CYD18S72V-133BBI

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Mfr.Part #
CYD18S72V-133BBI
Manufacturer
Infineon Technologies
Package / Case
484-BGA
Datasheet
Download
Description
IC SRAM 18MBIT PARALLEL 484FBGA
Stock
13,739
In Stock :
13,739

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Manufacturer :
Infineon Technologies
Product Category :
Memory
Operating Temperature :
-40°C~85°C TA
Package / Case :
484-BGA
Memory Format :
SRAM
Memory Size :
18Mb 256K x 72
Mounting Type :
Surface Mount
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Voltage - Supply :
3.135V~3.465V
Packaging :
Tray
Clock Frequency :
133MHz
Memory Interface :
Parallel
Access Time :
5ns
Memory Type :
Volatile
RoHS Status :
Non-RoHS Compliant
Supplier Device Package :
484-FBGA (23x23)
Datasheets
CYD18S72V-133BBI
Introducing Memory Infineon Technologies CYD18S72V-133BBI from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C~85°C TA, Package / Case:484-BGA, Mounting Type:Surface Mount, CYD18S72V-133BBI pinout, CYD18S72V-133BBI datasheet PDF, CYD18S72V-133BBI amp .Beyond Memory Infineon Technologies CYD18S72V-133BBI ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Infineon Technologies CYD18S72V-133BBI


Memory Infineon Technologies CYD18S72V-133BBI Overview

The Infineon Technologies CYD18S72V-133BBI is a high-performance 18Mbit SRAM IC designed for demanding applications requiring fast access and high data throughput. This memory component is encapsulated in a 484-pin FBGA (Fine-pitch Ball Grid Array) package, ensuring compact integration and robust reliability. With its parallel interface, the CYD18S72V-133BBI offers exceptional speed, making it ideal for advanced computing and digital signal processing tasks. The integration of this Memory Infineon Technologies CYD18S72V-133BBI in your systems guarantees improved system responsiveness and enhanced handling of large data buffers.

CYD18S72V-133BBI Features

  • 18Mbit density
  • Parallel interface for high-speed data access
  • 484 FBGA package for reliable physical integrity
  • Designed for low power consumption
  • Supports a wide range of operating temperatures

CYD18S72V-133BBI Applications

  • High-performance Computing: Utilized in servers and high-performance computers to manage large volumes of data rapidly.
  • Networking Equipment: Essential for data buffer management in switches and routers, enhancing throughput and performance.
  • Telecommunications: Supports fast data access needs of telecom infrastructure, improving signal processing capabilities.
  • Industrial Automation: Integrates into control systems to handle complex processes and real-time data analysis.
  • Automotive Systems: Used in advanced driver-assistance systems (ADAS) to process and store large amounts of sensor data quickly.
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Shipping Cost

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