XCV600E-8FG676C

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Mfr.Part #
XCV600E-8FG676C
Manufacturer
AMD Xilinx
Package / Case
676-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 444 I/O 676FCBGA
Stock
9,643
In Stock :
9,643

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Operating Temperature :
0°C~85°C TJ
Clock Frequency :
416MHz
Package / Case :
676-BBGA, FCBGA
RAM Size :
36KB
Number of I/O :
444
Number of Pins :
676
Pbfree Code :
No
Series :
Virtex®-E
Radiation Hardening :
No
Number of Gates :
985882
Packaging :
Tray
Terminal Pitch :
1mm
Published :
1999
Peak Reflow Temperature (Cel) :
225
Terminal Finish :
Tin/Lead (Sn63Pb37)
Mount :
Surface Mount
Lead Free :
Contains Lead
Width :
27mm
JESD-609 Code :
e0
Combinatorial Delay of a CLB-Max :
0.4 ns
Time@Peak Reflow Temperature-Max (s) :
30
Length :
27mm
Base Part Number :
XCV600E
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Terminal Position :
BOTTOM
Number of Logic Elements/Cells :
15552
Supply Voltage :
1.8V
Height Seated (Max) :
2.6mm
Number of Terminations :
676
Total RAM Bits :
294912
ECCN Code :
3A991.D
Speed Grade :
8
Pin Count :
676
Mounting Type :
Surface Mount
Terminal Form :
Ball
Voltage - Supply :
1.71V~1.89V
Operating Supply Voltage :
1.8V
Number of Outputs :
444
RoHS Status :
Non-RoHS Compliant
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Number of LABs/CLBs :
3456
Datasheets
XCV600E-8FG676C
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCV600E-8FG676C from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C~85°C TJ, Package / Case:676-BBGA, FCBGA, Number of Pins:676, Base Part Number:XCV600E, Number of Terminations:676, Mounting Type:Surface Mount, XCV600E-8FG676C pinout, XCV600E-8FG676C datasheet PDF, XCV600E-8FG676C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCV600E-8FG676C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XCV600E-8FG676C


FPGAs AMD Xilinx XCV600E-8FG676C Overview

Introducing the FPGAs AMD Xilinx XCV600E-8FG676C, a high-performance field-programmable gate array designed to meet the rigorous demands of modern digital processing. This device from AMD Xilinx integrates a vast array of functionalities suitable for complex applications requiring high-speed data processing and flexibility. With a dense 676-pin flip-chip ball grid array (FCBGA) package, it provides a robust I/O interface of 444 pins, making it highly adaptable for a wide range of industrial applications. The XCV600E-8FG676C is tailored to support extensive logic operations, enabling developers to implement specific configurations and updates post-deployment, which enhances product lifecycles and adaptability in fast-evolving technological landscapes.

XCV600E-8FG676C Features

The XCV600E-8FG676C FPGA features advanced capabilities including a vast network of programmable logic cells, high-speed transceivers, and a flexible I/O architecture. It supports multiple logic configurations, facilitating the integration of custom hardware accelerators directly onto the chip. Additionally, this FPGA offers extensive support for embedded processing, which is critical for developing high-throughput, real-time systems. Its scalability and high performance make it an ideal choice for developers looking to innovate and extend the capabilities of their digital systems.

XCV600E-8FG676C Applications

  • Telecommunications: Utilized in signal processing equipment, routing, and switching systems, the XCV600E-8FG676C helps in managing data flows efficiently across network infrastructures, enhancing bandwidth and reducing latency.
  • Automotive: Supports advanced driver-assistance systems (ADAS) by processing inputs from multiple sensors to provide real-time responses, crucial for safety and performance in modern vehicles.
  • Medical Imaging: Applied in the development of high-resolution imaging systems such as MRI and CT scanners, offering the necessary computational power to handle large volumes of data for detailed image reconstruction.
  • Industrial Automation: Ideal for controlling robotic systems and automation processes, providing the flexibility to reconfigure logic for different tasks and environments, thereby optimizing operational efficiency.
  • Aerospace and Defense: Used in satellite communications and radar systems, the FPGA withstands harsh environments and provides dependable performance under extreme conditions, ensuring reliability and security in critical applications.
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