XCV600-5BG560I

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Mfr.Part #
XCV600-5BG560I
Manufacturer
AMD Xilinx
Package / Case
560-LBGA Exposed Pad, Metal
Datasheet
Download
Description
IC FPGA 404 I/O 560MBGA
Stock
32,404
In Stock :
32,404

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Number of Outputs :
404
Height Seated (Max) :
1.7mm
Operating Supply Voltage :
2.5V
Mount :
Surface Mount
Package / Case :
560-LBGA Exposed Pad, Metal
Number of Inputs :
404
Mounting Type :
Surface Mount
Terminal Form :
Ball
Total RAM Bits :
98304
Reach Compliance Code :
not_compliant
Combinatorial Delay of a CLB-Max :
0.7 ns
Number of LABs/CLBs :
3456
Number of Gates :
661111
Packaging :
Tray
Operating Temperature :
-40°C~100°C TJ
RAM Size :
12kB
Voltage - Supply :
2.375V~2.625V
Time@Peak Reflow Temperature-Max (s) :
30
Lead Free :
Contains Lead
Number of Terminations :
560
Number of Logic Elements/Cells :
15552
Pbfree Code :
No
Terminal Finish :
Tin/Lead (Sn63Pb37)
Pin Count :
560
Published :
2000
Terminal Position :
BOTTOM
Speed Grade :
5
Peak Reflow Temperature (Cel) :
225
Qualification Status :
Not Qualified
Number of I/O :
404
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Supply Voltage :
2.5V
Clock Frequency :
294MHz
JESD-609 Code :
e0
Terminal Pitch :
1.27mm
Base Part Number :
XCV600
RoHS Status :
Non-RoHS Compliant
ECCN Code :
EAR99
Series :
Virtex®
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Datasheets
XCV600-5BG560I
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCV600-5BG560I from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:560-LBGA Exposed Pad, Metal, Mounting Type:Surface Mount, Operating Temperature:-40°C~100°C TJ, Number of Terminations:560, Base Part Number:XCV600, XCV600-5BG560I pinout, XCV600-5BG560I datasheet PDF, XCV600-5BG560I amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCV600-5BG560I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.



2.5V V 1.7mm mm FPGAs Virtex® Series 560-LBGA Exposed Pad, Metal 1.27mm mm 560

XCV600-5BG560I Overview


In the package 560-LBGA Exposed Pad, Metal, this product is provided. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. A total of 404 I/Os are programmed to ensure a more coherent data transfer. The basic building blocks of logic contain 15552 logic elements/cells. Supply voltage is 2.5V volts. By attaching the Surface Mount connector, you can use this FPGA module with your development board. With a supply voltage of 2.375V~2.625V, this device operates with ease. This is a type of FPGA that is part of the Virtex® series of FPGAs. Fpga chips is necessary to keep the operating temperature wFpga chipshin -40°C~100°C TJ when the device is operating. In this device, 404 outputs are incorporated in order to provide you with maximum flexibility. As a result of space limitations, this FPGA model has been included in Tray. In total, the terminations of this piece are 560. Fpga electronics is worth mentioning that this device provides 98304 bfpga electronics s of RAM. XCV600 is the base part number that can be used to identify related parts. The RAM si12kBe of this FPGA module reaches 12kB so as to guarantee the normal operation of the program during operation. The FPGA is built as an array of 3456 latches or CLBs. I think, as long as this FPGA is mounted in Surface Mount, it could perform excellently according to its specifications as long as you mount it in Surface Mount. In operation with 2.5V, designers can take advantage of its flexibility to the fullest extent. A basic building block for this type of building block consists of 661111 gates. I am going to present you with a device that is equipped with 560 pins. Fpga semiconductor typically uses a crystal oscillating at 294MHz.

XCV600-5BG560I Features


404 I/Os
Up to 98304 RAM bits


XCV600-5BG560I Applications


There are a lot of Xilinx Inc.
XCV600-5BG560I FPGAs applications.


  • Voice recognition
  • Cryptography
  • Filtering and communication encoding
  • Aerospace and Defense
  • Medical Electronics
  • Audio
  • Automotive
  • Consumer Electronics
  • Distributed Monetary Systems
  • Data Center
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