XCV600-4BG560I
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- Mfr.Part #
- XCV600-4BG560I
- Manufacturer
- AMD Xilinx
- Package / Case
- 560-LBGA Exposed Pad, Metal
- Datasheet
- Download
- Description
- IC FPGA 404 I/O 560MBGA
- Stock
- 3,292
- In Stock ：
- 3,292
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Pbfree Code :
- No
- Mounting Type :
- Surface Mount
- Terminal Pitch :
- 1.27mm
- Supply Voltage :
- 2.5V
- Total RAM Bits :
- 98304
- HTS Code :
- 8542.39.00.01
- Terminal Form :
- Ball
- Terminal Position :
- BOTTOM
- Clock Frequency :
- 250MHz
- Series :
- Virtex®
- ECCN Code :
- EAR99
- Length :
- 42.5mm
- Qualification Status :
- Not Qualified
- Pin Count :
- 560
- Number of I/O :
- 404
- Peak Reflow Temperature (Cel) :
- 225
- Power Supplies :
- 1.2/3.62.5V
- Number of Inputs :
- 404
- JESD-609 Code :
- e0
- Height Seated (Max) :
- 1.7mm
- Combinatorial Delay of a CLB-Max :
- 0.8 ns
- Packaging :
- Tray
- Number of Gates :
- 661111
- Number of Outputs :
- 404
- Mount :
- Surface Mount
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Base Part Number :
- XCV600
- Terminal Finish :
- Tin/Lead (Sn63Pb37)
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Reach Compliance Code :
- not_compliant
- Number of LABs/CLBs :
- 3456
- RAM Size :
- 12kB
- Width :
- 42.5mm
- Published :
- 2000
- RoHS Status :
- Non-RoHS Compliant
- Lead Free :
- Contains Lead
- Package / Case :
- 560-LBGA Exposed Pad, Metal
- JESD-30 Code :
- S-PBGA-B560
- Operating Temperature :
- -40°C~100°C TJ
- Voltage - Supply :
- 2.375V~2.625V
- Number of Logic Elements/Cells :
- 15552
- Number of Terminations :
- 560
- Datasheets
- XCV600-4BG560I
1.7mm mm FPGAs Virtex® Series 560-LBGA Exposed Pad, Metal 1.27mm mm 560
XCV600-4BG560I Overview
The package that contains this software is called 560-LBGA Exposed Pad, Metal. A FIELD PROGRAMMABLE GATE ARRAY-based FPGA is one of these types. There are 404 I/Os for better data transfer. In order to construct a fundamental building block, 15552 logic elements/cells are required. In order for the device to operate, a supply voltage of 2.5V volts needs to be provided. FPGA modules can be attached to development boards using a Surface Mount-connector. This device is powered by a 2.375V~2.625V battery. There are many types of FPGAs in the Virtex® series, this is one of them. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range -40°C~100°C TJ while the machine is operating. A device such as this one has 404 outputs built into it. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. In total, it has a total of 560 terminations. As far as the RAM bits are concerned, this device offers you a total of 98304. If you are looking for related parts, you can use the base part number XCV600 as a starting point. For the program to work properly, the RAM si12kBe of this FPGA module must reach 12kB GB in order to ensure normal operation. 3456 LABs/CLBs are configured on this FPGA. In my opinion, this FPGA could produce fantastic results if mounted in Surface Mount, provided that its specifications are followed. In order for fpga electronics to work, fpga electronics requires a 1.2/3.62.5V power supply. As a basic building block, fpga semiconductor consists of 661111 gates. A total of 560 pins are included in this device. Most of the time, it uses a crystal oscillating at 250MHz to generate the signal.
XCV600-4BG560I Features
404 I/Os
Up to 98304 RAM bits
XCV600-4BG560I Applications
There are a lot of Xilinx Inc.
XCV600-4BG560I FPGAs applications.
- Random logic
- ASIC prototyping
- Medical imaging
- Computer hardware emulation
- Integrating multiple SPLDs
- Voice recognition
- Cryptography
- Filtering and communication encoding
- Aerospace and Defense
- Medical Electronics
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