XCV600-4FG676I

Manufacturer :

AMD Xilinx

Product Category :

FPGAs (Field Programmable Gate Array)

Number of I/O :

444

Lead Free :

Contains Lead

Mounting Type :

Surface Mount

Operating Temperature :

-40°C~100°C TJ

Package / Case :

676-BBGA, FCBGA

Reach Compliance Code :

not_compliant

JESD-30 Code :

S-PBGA-B676

Number of Logic Elements/Cells :

15552

Number of Inputs :

444

Number of Gates :

661111

Terminal Pitch :

1mm

Pbfree Code :

No

Number of Outputs :

444

Qualification Status :

Not Qualified

Base Part Number :

XCV600

Terminal Finish :

Tin/Lead (Sn63Pb37)

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Supply Voltage :

2.5V

Combinatorial Delay of a CLB-Max :

0.8 ns

Length :

27mm

Voltage - Supply :

2.375V~2.625V

Published :

2000

Programmable Logic Type :

FIELD PROGRAMMABLE GATE ARRAY

Height Seated (Max) :

2.6mm

Peak Reflow Temperature (Cel) :

225

Total RAM Bits :

98304

Series :

Virtex®

Terminal Form :

Ball

ECCN Code :

EAR99

Pin Count :

676

JESD-609 Code :

e0

Number of Terminations :

676

Clock Frequency :

250MHz

Time@Peak Reflow Temperature-Max (s) :

30

RAM Size :

12kB

Power Supplies :

1.2/3.62.5V

Packaging :

Tray

Width :

27mm

Terminal Position :

BOTTOM

RoHS Status :

Non-RoHS Compliant

Mount :

Surface Mount

HTS Code :

8542.39.00.01

Number of LABs/CLBs :

3456