XCV600-4FG676I

Manufacturer :

AMD Xilinx

Product Category :

FPGAs (Field Programmable Gate Array)

Peak Reflow Temperature (Cel) :

225

Width :

27mm

Number of Inputs :

444

RAM Size :

12kB

ECCN Code :

EAR99

Combinatorial Delay of a CLB-Max :

0.8 ns

Mount :

Surface Mount

JESD-609 Code :

e0

Operating Temperature :

-40°C~100°C TJ

Lead Free :

Contains Lead

Programmable Logic Type :

FIELD PROGRAMMABLE GATE ARRAY

Number of Outputs :

444

Terminal Pitch :

1mm

HTS Code :

8542.39.00.01

Pbfree Code :

No

Qualification Status :

Not Qualified

Length :

27mm

Time@Peak Reflow Temperature-Max (s) :

30

Total RAM Bits :

98304

Number of LABs/CLBs :

3456

Voltage - Supply :

2.375V~2.625V

Mounting Type :

Surface Mount

Number of I/O :

444

Power Supplies :

1.2/3.62.5V

Series :

Virtex®

Height Seated (Max) :

2.6mm

RoHS Status :

Non-RoHS Compliant

Number of Logic Elements/Cells :

15552

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

JESD-30 Code :

S-PBGA-B676

Clock Frequency :

250MHz

Number of Gates :

661111

Package / Case :

676-BBGA, FCBGA

Number of Terminations :

676

Packaging :

Tray

Reach Compliance Code :

not_compliant

Terminal Position :

BOTTOM

Terminal Form :

Ball

Supply Voltage :

2.5V

Base Part Number :

XCV600

Terminal Finish :

Tin/Lead (Sn63Pb37)

Pin Count :

676

Published :

2000