XCV600E-7BG560I
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- Mfr.Part #
- XCV600E-7BG560I
- Manufacturer
- AMD Xilinx
- Package / Case
- 560-LBGA Exposed Pad, Metal
- Datasheet
- Download
- Description
- IC FPGA 404 I/O 560MBGA
- Stock
- 34,329
- In Stock ：
- 34,329
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Width :
- 42.5mm
- JESD-30 Code :
- S-PBGA-B560
- Terminal Position :
- BOTTOM
- Total RAM Bits :
- 294912
- Packaging :
- Tray
- Length :
- 42.5mm
- Combinatorial Delay of a CLB-Max :
- 0.42 ns
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Mount :
- Surface Mount
- Base Part Number :
- XCV600E
- Lead Free :
- Contains Lead
- Speed Grade :
- 7
- HTS Code :
- 8542.39.00.01
- JESD-609 Code :
- e0
- Operating Supply Voltage :
- 1.8V
- RoHS Status :
- Non-RoHS Compliant
- Number of Outputs :
- 404
- Number of Logic Elements/Cells :
- 15552
- Supply Voltage :
- 1.8V
- Number of LABs/CLBs :
- 3456
- RAM Size :
- 36KB
- Package / Case :
- 560-LBGA Exposed Pad, Metal
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Pbfree Code :
- No
- Terminal Form :
- Ball
- Voltage - Supply :
- 1.71V~1.89V
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Peak Reflow Temperature (Cel) :
- 225
- Number of Terminations :
- 560
- Clock Frequency :
- 400MHz
- Number of I/O :
- 404
- Number of Inputs :
- 404
- ECCN Code :
- 3A991.D
- Series :
- Virtex®-E
- Number of Gates :
- 985882
- Number of Equivalent Gates :
- 186624
- Radiation Hardening :
- No
- Mounting Type :
- Surface Mount
- Published :
- 2004
- Operating Temperature :
- -40°C~100°C TJ
- Pin Count :
- 560
- Datasheets
- XCV600E-7BG560I
1.8V V FPGAs Virtex®-E Series 560-LBGA Exposed Pad, Metal 560
XCV600E-7BG560I Overview
The package that contains this software is called 560-LBGA Exposed Pad, Metal. A FIELD PROGRAMMABLE GATE ARRAY-based FPGA is one of these types. There are 404 I/Os for better data transfer. In order to construct a fundamental building block, 15552 logic elements/cells are required. In order for the device to operate, a supply voltage of 1.8V volts needs to be provided. FPGA modules can be attached to development boards using a Surface Mount-connector. This device is powered by a 1.71V~1.89V battery. There are many types of FPGAs in the Virtex®-E series, this is one of them. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range -40°C~100°C TJ while the machine is operating. A device such as this one has 404 outputs built into it. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. In total, it has a total of 560 terminations. As far as the RAM bits are concerned, this device offers you a total of 294912. If you are looking for related parts, you can use the base part number XCV600E as a starting point. For the program to work properly, the RAM si36kBe of this FPGA module must reach 36kB GB in order to ensure normal operation. 3456 LABs/CLBs are configured on this FPGA. In my opinion, this FPGA could produce fantastic results if mounted in Surface Mount, provided that its specifications are followed. Design engineers can fully take advantage of its flexibility when operating at 1.8V supply voltage. As a basic building block, fpga semiconductor consists of 985882 gates. A total of 560 pins are included in this device. Most of the time, it uses a crystal oscillating at 400MHz to generate the signal. The FPGA implements the design using 186624 equivalent gates.
XCV600E-7BG560I Features
404 I/Os
Up to 294912 RAM bits
XCV600E-7BG560I Applications
There are a lot of Xilinx Inc.
XCV600E-7BG560I FPGAs applications.
- Random logic
- ASIC prototyping
- Medical imaging
- Computer hardware emulation
- Integrating multiple SPLDs
- Voice recognition
- Cryptography
- Filtering and communication encoding
- Aerospace and Defense
- Medical Electronics
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