S29GL032N11TFIV10

Manufacturer :

Infineon Technologies

Product Category :

Memory

Peak Reflow Temperature (Cel) :

260

Common Flash Interface :

yes

Page Size :

8/16words

Standby Current-Max :

0.000005A

Nominal Supply Current :

50mA

Height Seated (Max) :

1.2mm

ECCN Code :

3A991.B.1.A

Published :

2003

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Number of Pins :

56

Write Cycle Time - Word, Page :

110ns

Memory Interface :

Parallel

JESD-609 Code :

e3

Package / Case :

56-TFSOP (0.724, 18.40mm Width)

Series :

GL-N

Data Polling :

yes

Sector Size :

64K

Organization :

2MX16

Number of Terminations :

56

Memory Format :

Flash

RoHS Status :

ROHS3 Compliant

Supply Voltage :

3V

Memory Width :

16

Sync/Async :

ASYNCHRONOUS

Supply Voltage-Max (Vsup) :

3.6V

Voltage - Supply :

1.65V~3.6V

Terminal Pitch :

0.5mm

Alternate Memory Width :

8

Number of Functions :

1

Density :

32 Mb

Ready/Busy :

yes

Data Bus Width :

16b

Programming Voltage :

3V

Time@Peak Reflow Temperature-Max (s) :

40

Power Supplies :

1.8/3.33/3.3V

Command User Interface :

yes

Terminal Position :

Dual

Mounting Type :

Surface Mount

Radiation Hardening :

No

Operating Temperature :

-40°C~85°C TA

Packaging :

Tray

Access Time (Max) :

110 ns

Memory Size :

32Mb 4M x 8 2M x 16

Number of Sectors/Size :

64

Toggle Bit :

yes

Supply Voltage-Min (Vsup) :

2.7V

Mount :

Surface Mount

Memory Type :

Non-Volatile

Boot Block :

BOTTOM/TOP

Factory Lead Time :

6 Weeks

Terminal Finish :

Matte Tin (Sn)

Length :

18.4mm

HTS Code :

8542.32.00.51