MK60DN512ZVMC10

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

Connectivity :

CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART

DMA Channels :

yes

JESD-609 Code :

e1

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Core Processor :

ARM® Cortex®-M4

Packaging :

Tray

Surface Mount :

yes

Bit Size :

32

PWM Channels :

yes

Terminal Form :

Ball

Factory Lead Time :

13 Weeks

Peak Reflow Temperature (Cel) :

260

Terminal Position :

BOTTOM

Height Seated (Max) :

1.52mm

Length :

8mm

Peripherals :

DMA, I2S, LVD, POR, PWM, WDT

Qualification Status :

Not Qualified

Supply Voltage-Min (Vsup) :

1.71V

Number of Terminations :

121

Published :

2013

Package / Case :

121-LFBGA

Number of I/O :

86

Core Size :

32-Bit

Voltage - Supply (Vcc/Vdd) :

1.71V~3.6V

Base Part Number :

K60DN512

Terminal Pitch :

0.65mm

RoHS Status :

ROHS3 Compliant

JESD-30 Code :

S-PBGA-B121

Terminal Finish :

TIN SILVER COPPER

Supply Voltage :

3.3V

Series :

Kinetis K60

Speed :

100MHz

Oscillator Type :

Internal

RAM Size :

128K x 8

Supply Voltage-Max (Vsup) :

3.6V

Operating Temperature :

-40°C~105°C TA

HTS Code :

8542.31.00.01

Width :

8mm

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER, RISC

ECCN Code :

3A991.A.2

Program Memory Type :

Flash

Time@Peak Reflow Temperature-Max (s) :

40

Program Memory Size :

512KB 512K x 8

DAC Channels :

yes

Clock Frequency :

32MHz

Has ADC :

yes

Mounting Type :

Surface Mount

Data Converter :

A/D 38x16b; D/A 2x12b