MK60DN256VMC10

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

RAM Size :

64K x 8

RoHS Status :

ROHS3 Compliant

Peripherals :

DMA, I2S, LVD, POR, PWM, WDT

Supply Voltage-Min (Vsup) :

1.71V

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Time@Peak Reflow Temperature-Max (s) :

40

Voltage - Supply (Vcc/Vdd) :

1.71V~3.6V

Height Seated (Max) :

1.52mm

Mounting Type :

Surface Mount

Terminal Finish :

TIN SILVER COPPER

Bit Size :

32

Oscillator Type :

Internal

Data Converter :

A/D 42x16b; D/A 2x12b

JESD-609 Code :

e1

ECCN Code :

3A991.A.2

Qualification Status :

Not Qualified

Operating Temperature :

-40°C~105°C TA

DAC Channels :

yes

Terminal Form :

Ball

Number of I/O :

100

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER, RISC

PWM Channels :

yes

Supply Voltage-Max (Vsup) :

3.6V

CPU Family :

CORTEX-M4

Connectivity :

I²C, IrDA, LINbus, SPI, UART/USART

Speed :

100MHz

Series :

Kinetis K60

Supply Voltage :

3.3V

Program Memory Type :

Flash

Core Processor :

ARM® Cortex®-M4

Clock Frequency :

32MHz

Surface Mount :

yes

Core Size :

32-Bit

Package / Case :

121-LFBGA

Factory Lead Time :

13 Weeks

Peak Reflow Temperature (Cel) :

260

Supply Current-Max :

77mA

Packaging :

Tray

ROM (words) :

262144

Length :

8mm

JESD-30 Code :

S-PBGA-B121

Published :

2013

Number of Terminations :

121

Has ADC :

yes

Power Supplies :

1.8/3V

HTS Code :

8542.31.00.01

Program Memory Size :

256KB 256K x 8

RAM (bytes) :

65536

Terminal Position :

BOTTOM

Width :

8mm

Terminal Pitch :

0.65mm

DMA Channels :

yes