MK60DN256VMD10

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

RoHS Status :

ROHS3 Compliant

Height Seated (Max) :

1.7mm

Program Memory Size :

256KB 256K x 8

Peripherals :

DMA, I2S, LVD, POR, PWM, WDT

Factory Lead Time :

13 Weeks

PWM Channels :

yes

Program Memory Type :

Flash

ROM (words) :

262144

Supply Voltage-Max (Vsup) :

3.6V

Core Processor :

ARM® Cortex®-M4

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Time@Peak Reflow Temperature-Max (s) :

40

Connectivity :

CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART

HTS Code :

8542.31.00.01

Terminal Position :

BOTTOM

Mounting Type :

Surface Mount

Qualification Status :

Not Qualified

Width :

13mm

Number of I/O :

100

Package / Case :

144-LBGA

Has ADC :

yes

Supply Voltage :

3.3V

Clock Frequency :

32MHz

ECCN Code :

3A991.A.2

Supply Voltage-Min (Vsup) :

1.71V

Core Size :

32-Bit

Terminal Pitch :

1mm

JESD-609 Code :

e1

JESD-30 Code :

S-PBGA-B144

Peak Reflow Temperature (Cel) :

260

Voltage - Supply (Vcc/Vdd) :

1.71V~3.6V

Surface Mount :

yes

Speed :

100MHz

Data Converter :

A/D 42x16b; D/A 2x12b

Power Supplies :

1.8/3.3V

Oscillator Type :

Internal

Operating Temperature :

-40°C~105°C TA

Published :

2012

Series :

Kinetis K60

Packaging :

Tray

CPU Family :

CORTEX-M4

RAM Size :

64K x 8

Terminal Finish :

TIN SILVER COPPER

DMA Channels :

yes

Base Part Number :

MK60DN256

Bit Size :

32

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER, RISC

Number of Terminations :

144

Supply Current-Max :

77mA

Length :

13mm

Terminal Form :

Ball

DAC Channels :

yes