MK60DN256VMD10

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

Operating Temperature :

-40°C~105°C TA

Core Size :

32-Bit

Time@Peak Reflow Temperature-Max (s) :

40

Supply Current-Max :

77mA

ROM (words) :

262144

Number of I/O :

100

Peak Reflow Temperature (Cel) :

260

Power Supplies :

1.8/3.3V

Peripherals :

DMA, I2S, LVD, POR, PWM, WDT

Supply Voltage-Max (Vsup) :

3.6V

Qualification Status :

Not Qualified

DAC Channels :

yes

Has ADC :

yes

HTS Code :

8542.31.00.01

Package / Case :

144-LBGA

DMA Channels :

yes

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER, RISC

Data Converter :

A/D 42x16b; D/A 2x12b

Voltage - Supply (Vcc/Vdd) :

1.71V~3.6V

Height Seated (Max) :

1.7mm

Surface Mount :

yes

Oscillator Type :

Internal

Connectivity :

CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART

Supply Voltage-Min (Vsup) :

1.71V

Terminal Form :

Ball

JESD-609 Code :

e1

Clock Frequency :

32MHz

Base Part Number :

MK60DN256

CPU Family :

CORTEX-M4

Bit Size :

32

JESD-30 Code :

S-PBGA-B144

Factory Lead Time :

13 Weeks

Series :

Kinetis K60

Program Memory Type :

Flash

PWM Channels :

yes

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

RoHS Status :

ROHS3 Compliant

Terminal Pitch :

1mm

Speed :

100MHz

Width :

13mm

Number of Terminations :

144

Core Processor :

ARM® Cortex®-M4

Supply Voltage :

3.3V

Length :

13mm

Program Memory Size :

256KB 256K x 8

ECCN Code :

3A991.A.2

RAM Size :

64K x 8

Mounting Type :

Surface Mount

Published :

2012

Terminal Finish :

TIN SILVER COPPER

Packaging :

Tray

Terminal Position :

BOTTOM