MK60DN256VMD10

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

HTS Code :

8542.31.00.01

RAM Size :

64K x 8

Peak Reflow Temperature (Cel) :

260

Number of Terminations :

144

ROM (words) :

262144

Program Memory Type :

Flash

Base Part Number :

MK60DN256

JESD-30 Code :

S-PBGA-B144

Published :

2012

RoHS Status :

ROHS3 Compliant

Has ADC :

yes

Clock Frequency :

32MHz

Oscillator Type :

Internal

Voltage - Supply (Vcc/Vdd) :

1.71V~3.6V

Factory Lead Time :

13 Weeks

Length :

13mm

Mounting Type :

Surface Mount

CPU Family :

CORTEX-M4

Package / Case :

144-LBGA

Supply Voltage-Max (Vsup) :

3.6V

Connectivity :

I²C, IrDA, LINbus, SPI, UART/USART

Terminal Finish :

TIN SILVER COPPER

Surface Mount :

yes

Supply Voltage-Min (Vsup) :

1.71V

Terminal Pitch :

1mm

ECCN Code :

3A991.A.2

Time@Peak Reflow Temperature-Max (s) :

40

Series :

Kinetis K60

Qualification Status :

Not Qualified

Terminal Form :

Ball

Peripherals :

DMA, I2S, LVD, POR, PWM, WDT

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER, RISC

Supply Current-Max :

77mA

Data Converter :

A/D 42x16b; D/A 2x12b

Width :

13mm

Core Size :

32-Bit

Power Supplies :

1.8/3.3V

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Terminal Position :

BOTTOM

Height Seated (Max) :

1.7mm

Supply Voltage :

3.3V

Operating Temperature :

-40°C~105°C TA

JESD-609 Code :

e1

DAC Channels :

yes

Program Memory Size :

256KB 256K x 8

Number of I/O :

100

PWM Channels :

yes

Core Processor :

ARM® Cortex®-M4

DMA Channels :

yes

Speed :

100MHz

Bit Size :

32

Packaging :

Tray