MK60DN512VMC10

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

Peak Reflow Temperature (Cel) :

260

Terminal Position :

BOTTOM

HTS Code :

8542.31.00.01

Mounting Type :

Surface Mount

Terminal Pitch :

0.65mm

Supply Voltage-Min (Vsup) :

1.71V

Core Processor :

ARM® Cortex®-M4

Supply Voltage-Max (Vsup) :

3.6V

Package / Case :

121-LFBGA

DMA Channels :

yes

RAM Size :

128K x 8

PWM Channels :

yes

Oscillator Type :

Internal

Power Supplies :

1.8/3V

Published :

2013

Terminal Form :

Ball

Packaging :

Tray

JESD-30 Code :

S-PBGA-B121

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER, RISC

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Height Seated (Max) :

1.52mm

CPU Family :

CORTEX-M4

Operating Temperature :

-40°C~105°C TA

Program Memory Size :

512KB 512K x 8

Factory Lead Time :

13 Weeks

Has ADC :

yes

Data Converter :

A/D 38x16b; D/A 2x12b

Core Size :

32-Bit

Width :

8mm

Bit Size :

32

Supply Voltage :

3.3V

ROM (words) :

524288

Base Part Number :

K60DN512

Qualification Status :

Not Qualified

Clock Frequency :

32MHz

Length :

8mm

JESD-609 Code :

e1

Terminal Finish :

TIN SILVER COPPER

Voltage - Supply (Vcc/Vdd) :

1.71V~3.6V

Connectivity :

CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART

Series :

Kinetis K60

RoHS Status :

ROHS3 Compliant

DAC Channels :

yes

Supply Current-Max :

77mA

Peripherals :

DMA, I2S, LVD, POR, PWM, WDT

Surface Mount :

yes

Number of Terminations :

121

Speed :

100MHz

ECCN Code :

3A991.A.2

Number of I/O :

86

Time@Peak Reflow Temperature-Max (s) :

40

Program Memory Type :

Flash