IRFIZ46N
- Mfr.Part #
- IRFIZ46N
- Manufacturer
- Infineon Technologies
- Package / Case
- TO-220-3 Full Pack
- Datasheet
- Download
- Description
- MOSFET N-CH 55V 33A TO220AB FP
- Stock
- 1,262
- In Stock :
- 1,262
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Transistors - FETs, MOSFETs - Single
- Vgs (Max) :
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds :
- 1500pF @ 25V
- Pulsed Drain Current-Max (IDM) :
- 180A
- Number of Elements :
- 1
- Drain-source On Resistance-Max :
- 0.02Ohm
- Surface Mount :
- No
- JESD-609 Code :
- e3
- RoHS Status :
- Non-RoHS Compliant
- Avalanche Energy Rating (Eas) :
- 230 mJ
- Drive Voltage (Max Rds On,Min Rds On) :
- 10V
- Current - Continuous Drain (Id) @ 25°C :
- 33A Tc
- Transistor Element Material :
- SILICON
- Terminal Position :
- Single
- Qualification Status :
- Not Qualified
- Case Connection :
- Isolated
- Published :
- 1997
- Package / Case :
- TO-220-3 Full Pack
- Packaging :
- Tube
- Drain Current-Max (Abs) (ID) :
- 33A
- Number of Terminations :
- 3
- Gate Charge (Qg) (Max) @ Vgs :
- 61nC @ 10V
- Series :
- HEXFET®
- Configuration :
- SINGLE WITH BUILT-IN DIODE
- Power Dissipation-Max :
- 45W Tc
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Operating Temperature :
- -55°C~175°C TJ
- FET Type :
- N-Channel
- Drain to Source Voltage (Vdss) :
- 55V
- Mounting Type :
- Through Hole
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- DS Breakdown Voltage-Min :
- 55V
- JESD-30 Code :
- R-PSFM-T3
- ECCN Code :
- EAR99
- Transistor Application :
- SWITCHING
- Rds On (Max) @ Id, Vgs :
- 20m Ω @ 19A, 10V
- Additional Feature :
- High Reliability
- Operating Mode :
- ENHANCEMENT MODE
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Vgs(th) (Max) @ Id :
- 4V @ 250µA
- Terminal Finish :
- Matte Tin (Sn) - with Nickel (Ni) barrier
- Datasheets
- IRFIZ46N

N-Channel Tube 20m Ω @ 19A, 10V ±20V 1500pF @ 25V 61nC @ 10V 55V TO-220-3 Full Pack
IRFIZ46N Description
Fifth Generation HEXFETs from International Rectifier utilize advanced processing techniques to achieve the lowest possible on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET Power MOSFETs are well known for, provides the designer with an extremely efficient device for use in a wide variety of applications.
IRFIZ46N Features
Advanced Process Technology
Isolated Package
High Voltage Isolation = 2.5KVRMS ?
Sink to Lead Creepage Dist. = 4.8mm
Fully Avalanche Rated
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