DF200R12KE3HOSA1
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- Mfr.Part #
- DF200R12KE3HOSA1
- Manufacturer
- Infineon Technologies
- Package / Case
- Module
- Datasheet
- Download
- Description
- IGBT MODULE 1200V 1040W
- Stock
- 290
- In Stock ：
- 290
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Transistors - IGBTs - Modules
- Power - Max :
- 1040W
- Number of Pins :
- 5
- Factory Lead Time :
- 14 Weeks
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- ECCN Code :
- EAR99
- Turn Off Time-Nom (toff) :
- 830 ns
- Input :
- Standard
- Input Capacitance (Cies) @ Vce :
- 14nF @ 25V
- NTC Thermistor :
- No
- Number of Terminations :
- 5
- Published :
- 2012
- Turn On Time :
- 400 ns
- Number of Elements :
- 1
- Mount :
- Screw
- Current - Collector Cutoff (Max) :
- 5mA
- Collector Emitter Saturation Voltage :
- 1.7V
- Case Connection :
- Isolated
- Polarity/Channel Type :
- N-Channel
- Pbfree Code :
- yes
- Package / Case :
- Module
- Vce(on) (Max) @ Vge, Ic :
- 2.15V @ 15V, 200A
- Lead Free :
- Lead Free
- Terminal Position :
- UPPER
- Halogen Free :
- Not Halogen Free
- Collector Emitter Voltage (VCEO) :
- 1.2kV
- Pin Count :
- 5
- Transistor Element Material :
- SILICON
- Max Collector Current :
- 295A
- Voltage - Collector Emitter Breakdown (Max) :
- 1200V
- Power Dissipation :
- 1.04kW
- Operating Temperature :
- -40°C~125°C
- Mounting Type :
- Chassis Mount
- Configuration :
- Single
- RoHS Status :
- RoHS Compliant
- Terminal Form :
- UNSPECIFIED
- Datasheets
- DF200R12KE3HOSA1
DF200R12KE3HOSA1 datasheet pdf and Transistors - IGBTs - Modules product details from Infineon Technologies stock available at
DF200R12KE3HOSA1 Description
IGBT (Insulated Gate Bipolar Transistor) module is a device required for inverter use in many types of industrial equipment, and had driven the trend towards high currents and high voltage since 1990.
DF200R12KE3HOSA1 Applications
· Air Conditioning
· Motor Drives
· Servo Drives
· UPS Systems
DF200R12KE3HOSA1 Features
· Low Switching Losses
· Low VCEsat
· Trench IGBT 4
· VCEsatwith positive Temperature Coefficient
Mechanical Features
· AlzO Substrate with Low Thermal Resistance
· Compact design
· PressFIT Contact Technology
· Rugged Duplex frame construction
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