BU8872FS-E2

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Mfr.Part #
BU8872FS-E2
Manufacturer
ROHM Semiconductor
Package / Case
16-LSOP (0.173, 4.40mm Width)
Datasheet
Download
Description
IC TELECOM INTERFACE SSOP-A16
Stock
7,324
In Stock :
7,324

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Manufacturer :
ROHM Semiconductor
Product Category :
Telecom
Height :
1.39mm
Mount :
Surface Mount
Packaging :
Tape and Reel (TR)
Peak Reflow Temperature (Cel) :
260
Supply Voltage :
5V
Terminal Position :
Dual
Terminal Form :
Gull wing
JESD-609 Code :
e3/e2
Width :
4.4mm
Voltage - Supply :
4.5V~5.5V
Pbfree Code :
yes
Mounting Type :
Surface Mount
Function :
Receiver, DTMF
Time@Peak Reflow Temperature-Max (s) :
10
Qualification Status :
Not Qualified
Frequency :
4.19MHz
RoHS Status :
ROHS3 Compliant
Base Part Number :
BU887*
Operating Temperature :
-40°C~85°C
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Operating Supply Current :
3.4mA
Number of Circuits :
1
Terminal Finish :
TIN/TIN COPPER
Weight :
130.010913mg
Package / Case :
16-LSOP (0.173, 4.40mm Width)
Telecom IC Type :
DTMF SIGNALING CIRCUIT
Number of Terminations :
16
Operating Supply Voltage :
5V
Terminal Pitch :
0.8mm
Length :
6.6mm
Max Power Dissipation :
650mW
Nominal Supply Current :
4.4mA
Published :
1998
Power Supplies :
5V
Logic Function :
Receiver
Number of Pins :
16
Lead Free :
Lead Free
Datasheets
BU8872FS-E2
Introducing Telecom ROHM Semiconductor BU8872FS-E2 from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Base Part Number:BU887*, Operating Temperature:-40°C~85°C, Package / Case:16-LSOP (0.173, 4.40mm Width), Number of Terminations:16, Number of Pins:16, BU8872FS-E2 pinout, BU8872FS-E2 datasheet PDF, BU8872FS-E2 amp .Beyond Telecom ROHM Semiconductor BU8872FS-E2 ,we also offer CPC5712UTR, MT8870DS1, SI32176-C-FM1R, Our vast inventory has you covered. Contact us now for immediate solutions.

ROHM Semiconductor BU8872FS-E2


Telecom ROHM Semiconductor BU8872FS-E2 Overview

The BU8872FS-E2 from ROHM Semiconductor is a sophisticated IC telecom interface that serves as a pivotal component in modern communication systems. Designed for high reliability and enhanced performance, this IC enables robust interfacing capabilities within telecom infrastructure. The BU8872FS-E2 is engineered in a compact SSOPA16 package, making it ideal for applications where space and efficiency are at a premium. As a product tailored for demanding telecom environments, it ensures seamless operation and integration into multiple telecom applications, enhancing both system stability and functionality.

BU8872FS-E2 Features

The BU8872FS-E2 IC is distinguished by its high-performance features which include advanced signal integrity, low power consumption, and a high degree of integration. The device's ability to handle complex data streams with high accuracy makes it an invaluable part of telecom hardware. Moreover, its small form factor SSOPA16 packaging allows for efficient use of circuit board space, which is crucial in the design of modern compact telecom equipment.

BU8872FS-E2 Applications

  • Mobile Phone Systems: Utilized in the signal processing chain to manage data transmission and reception, enhancing communication clarity and reliability.
  • Telecommunication Switching Systems: Acts as a crucial component in switching systems to facilitate the efficient routing and processing of voice and data packets across networks.
  • Modems: Integral in modems for converting digital data into signals and vice versa, ensuring smooth and effective broadband connectivity.
  • Fax Machines: Used to modulate and demodulate the signals during fax transmission, providing reliable and fast document transmission.
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