BU8872FS-E2

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Mfr.Part #
BU8872FS-E2
Manufacturer
ROHM Semiconductor
Package / Case
16-LSOP (0.173, 4.40mm Width)
Datasheet
Download
Description
IC TELECOM INTERFACE SSOP-A16
Stock
7,324
In Stock :
7,324

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Manufacturer :
ROHM Semiconductor
Product Category :
Telecom
Number of Circuits :
1
Height :
1.39mm
RoHS Status :
ROHS3 Compliant
Packaging :
Tape and Reel (TR)
Mount :
Surface Mount
Mounting Type :
Surface Mount
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Terminal Form :
Gull wing
Voltage - Supply :
4.5V~5.5V
Logic Function :
Receiver
Supply Voltage :
5V
Operating Temperature :
-40°C~85°C
Operating Supply Current :
3.4mA
Base Part Number :
BU887*
Published :
1998
Weight :
130.010913mg
Max Power Dissipation :
650mW
JESD-609 Code :
e3/e2
Operating Supply Voltage :
5V
Terminal Pitch :
0.8mm
Qualification Status :
Not Qualified
Nominal Supply Current :
4.4mA
Package / Case :
16-LSOP (0.173, 4.40mm Width)
Number of Pins :
16
Frequency :
4.19MHz
Telecom IC Type :
DTMF SIGNALING CIRCUIT
Number of Terminations :
16
Function :
Receiver, DTMF
Power Supplies :
5V
Pbfree Code :
yes
Lead Free :
Lead Free
Time@Peak Reflow Temperature-Max (s) :
10
Length :
6.6mm
Terminal Position :
Dual
Peak Reflow Temperature (Cel) :
260
Terminal Finish :
TIN/TIN COPPER
Width :
4.4mm
Datasheets
BU8872FS-E2
Introducing Telecom ROHM Semiconductor BU8872FS-E2 from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Operating Temperature:-40°C~85°C, Base Part Number:BU887*, Package / Case:16-LSOP (0.173, 4.40mm Width), Number of Pins:16, Number of Terminations:16, BU8872FS-E2 pinout, BU8872FS-E2 datasheet PDF, BU8872FS-E2 amp .Beyond Telecom ROHM Semiconductor BU8872FS-E2 ,we also offer CPC5712UTR, MT8870DS1, SI32176-C-FM1R, Our vast inventory has you covered. Contact us now for immediate solutions.

ROHM Semiconductor BU8872FS-E2


Telecom ROHM Semiconductor BU8872FS-E2 Overview

The BU8872FS-E2 from ROHM Semiconductor is a sophisticated IC telecom interface that serves as a pivotal component in modern communication systems. Designed for high reliability and enhanced performance, this IC enables robust interfacing capabilities within telecom infrastructure. The BU8872FS-E2 is engineered in a compact SSOPA16 package, making it ideal for applications where space and efficiency are at a premium. As a product tailored for demanding telecom environments, it ensures seamless operation and integration into multiple telecom applications, enhancing both system stability and functionality.

BU8872FS-E2 Features

The BU8872FS-E2 IC is distinguished by its high-performance features which include advanced signal integrity, low power consumption, and a high degree of integration. The device's ability to handle complex data streams with high accuracy makes it an invaluable part of telecom hardware. Moreover, its small form factor SSOPA16 packaging allows for efficient use of circuit board space, which is crucial in the design of modern compact telecom equipment.

BU8872FS-E2 Applications

  • Mobile Phone Systems: Utilized in the signal processing chain to manage data transmission and reception, enhancing communication clarity and reliability.
  • Telecommunication Switching Systems: Acts as a crucial component in switching systems to facilitate the efficient routing and processing of voice and data packets across networks.
  • Modems: Integral in modems for converting digital data into signals and vice versa, ensuring smooth and effective broadband connectivity.
  • Fax Machines: Used to modulate and demodulate the signals during fax transmission, providing reliable and fast document transmission.
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