BU8871F-E2

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Mfr.Part #
BU8871F-E2
Manufacturer
ROHM Semiconductor
Package / Case
18-SOIC (0.213, 5.40mm Width)
Datasheet
Download
Description
IC TELECOM INTERFACE 18SOP
Stock
43,279
In Stock :
43,279

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Manufacturer :
ROHM Semiconductor
Product Category :
Telecom
Published :
1998
Terminal Finish :
TIN/TIN COPPER
Pbfree Code :
yes
Peak Reflow Temperature (Cel) :
260
Mount :
Surface Mount
Operating Supply Current :
2.2mA
Operating Temperature :
-10°C~70°C
Qualification Status :
Not Qualified
Nominal Supply Current :
2.2mA
Lead Free :
Lead Free
Function :
Receiver, DTMF
Power Supplies :
5V
Telecom IC Type :
DTMF SIGNALING CIRCUIT
Package / Case :
18-SOIC (0.213, 5.40mm Width)
JESD-609 Code :
e3/e2
Number of Circuits :
1
Terminal Form :
Gull wing
Number of Pins :
18
Width :
5.4mm
Terminal Position :
Dual
Logic Function :
Receiver
Number of Terminations :
18
Base Part Number :
BU887*
Frequency :
4.19MHz
Voltage - Supply :
4.75V~5.25V
Supply Voltage :
5V
Operating Supply Voltage :
5V
Time@Peak Reflow Temperature-Max (s) :
10
Mounting Type :
Surface Mount
Packaging :
Tape and Reel (TR)
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
RoHS Status :
ROHS3 Compliant
Max Power Dissipation :
550mW
Datasheets
BU8871F-E2
Introducing Telecom ROHM Semiconductor BU8871F-E2 from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-10°C~70°C, Package / Case:18-SOIC (0.213, 5.40mm Width), Number of Pins:18, Number of Terminations:18, Base Part Number:BU887*, Mounting Type:Surface Mount, BU8871F-E2 pinout, BU8871F-E2 datasheet PDF, BU8871F-E2 amp .Beyond Telecom ROHM Semiconductor BU8871F-E2 ,we also offer CPC5712UTR, MT8870DS1, SI32176-C-FM1R, Our vast inventory has you covered. Contact us now for immediate solutions.

ROHM Semiconductor BU8871F-E2


Telecom ROHM Semiconductor BU8871F-E2 Overview

The Telecom ROHM Semiconductor BU8871F-E2 is a high-performance IC telecom interface designed to meet the rigorous demands of modern telecommunication systems. Manufactured by ROHM Semiconductor, a leader in semiconductor solutions, this interface IC offers exceptional reliability and functionality in a compact 18SOP package. It is specifically engineered to facilitate efficient and stable communication operations, making it an ideal choice for businesses looking to enhance their telecommunications infrastructure. The BU8871F-E2 supports advanced telecom functionalities, ensuring seamless integration into existing systems and scalability for future upgrades.

BU8871F-E2 Features

This IC telecom interface comes with a range of features designed to optimize telecommunication systems:

  • Compact 18SOP package for easy integration
  • High reliability and stability under varied environmental conditions
  • Supports multiple telecommunication standards and protocols
  • Low power consumption for energy-efficient operation
  • Enhanced signal integrity for improved communication quality

BU8871F-E2 Applications

  • Telecommunication Switching Systems: Integrates seamlessly into switching systems, enhancing signal processing and routing capabilities.
  • Modems: Used in modem designs to manage data transmission functions, ensuring reliable internet connectivity and communication.
  • VoIP Systems: Optimizes voice over IP communications by providing stable and clear signal pathways, essential for high-quality voice transmissions.
  • Fax Machines: Enhances the functionality of fax machines through superior signal handling, allowing for faster and more reliable document transmission.
  • Office Communication Networks: Plays a crucial role in office communication systems, improving internal communication infrastructure with advanced interfacing capabilities.
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