W947D6HBHX6E
- Mfr.Part #
- W947D6HBHX6E
- Manufacturer
- Winbond Electronics Corporation
- Package / Case
- 60-TFBGA
- Datasheet
- Download
- Description
- IC DRAM 128MBIT PARALLEL 60VFBGA
- Stock
- 20,396
- In Stock :
- 20,396
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- Manufacturer :
- Winbond Electronics Corporation
- Product Category :
- Memory
- Clock Frequency :
- 166MHz
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Pin Count :
- 60
- Refresh Cycles :
- 4096
- Published :
- 2011
- Supply Voltage :
- 1.8V
- Terminal Position :
- BOTTOM
- Write Cycle Time - Word, Page :
- 15ns
- Memory Size :
- 128Mb 8M x 16
- Data Bus Width :
- 16b
- Additional Feature :
- AUTO/SELF REFRESH
- Nominal Supply Current :
- 50mA
- Memory Type :
- Volatile
- ECCN Code :
- EAR99
- Memory Width :
- 16
- Supply Voltage-Min (Vsup) :
- 1.7V
- I/O Type :
- COMMON
- Number of Functions :
- 1
- Packaging :
- Tray
- Mount :
- Surface Mount
- Standby Current-Max :
- 0.00001A
- Terminal Pitch :
- 0.8mm
- Length :
- 9mm
- Height Seated (Max) :
- 1.025mm
- Memory Interface :
- Parallel
- Number of Ports :
- 1
- Interleaved Burst Length :
- 24816
- Operating Temperature :
- -25°C~85°C TC
- Operating Supply Voltage :
- 1.8V
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Number of Pins :
- 60
- Supply Voltage-Max (Vsup) :
- 1.95V
- Access Time :
- 5ns
- Address Bus Width :
- 14b
- Qualification Status :
- Not Qualified
- Number of Terminations :
- 60
- Package / Case :
- 60-TFBGA
- Memory Format :
- DRAM
- Mounting Type :
- Surface Mount
- Output Characteristics :
- 3-STATE
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Voltage - Supply :
- 1.7V~1.95V
- RoHS Status :
- ROHS3 Compliant
- HTS Code :
- 8542.32.00.02
- Sequential Burst Length :
- 24816
- Factory Lead Time :
- 10 Weeks
- Operating Mode :
- SYNCHRONOUS
- Organization :
- 8MX16
- Density :
- 128 Mb
- Datasheets
- W947D6HBHX6E

Memory Winbond Electronics Corporation W947D6HBHX6E Overview
As a product expert in Integrated Circuits, I present you with the Memory Winbond Electronics Corporation W947D6HBHX6E, a high-performance DRAM chip that serves as a testament to Winbond's commitment to quality and technological advancement. This 128Mbit DRAM module utilizes a parallel interface for dependable and swift data access, making it an ideal solution for memory-hungry applications. Encased in a compact 60-ball VFBGA package, the W947D6HBHX6E combines space efficiency with reliability, a hallmark of Winbond’s design ethos. With this Memory Winbond Electronics Corporation W947D6HBHX6E, B2B customers will witness unparalleled consistency and long-term endurance in their product designs, making it an astute selection for a multitude of commercial applications.
W947D6HBHX6E Features
- 128Mbit Density
- Parallel Interface
- 60-ball Very Fine Pitch Ball Grid Array (VFBGA) Package
- Lower Power consumption
- High-speed data transfer
W947D6HBHX6E Applications
- Consumer Electronics - Provides the necessary high-density memory for smooth operation in products such as high-definition televisions and gaming consoles.
- Computing - Integrates into laptops and desktops to enhance overall system performance and multitasking capabilities.
- Telecommunications - Supports the heavy data processing needs of networking equipment such as switches, routers, and base stations.
- Automotive Electronics - Delivers reliable performance under harsh conditions, suited for in-vehicle infotainment systems and advanced driver-assistance systems (ADAS).
- Industrial Automation - Apt for PLCs and control modules, where stable and consistent memory is critical for process management.
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