TMSDVC5510AGGWA2

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Mfr.Part #
TMSDVC5510AGGWA2
Manufacturer
Texas Instruments
Package / Case
240-LFBGA
Datasheet
Download
Description
IC DSP FIXED POINT BGA
Stock
47,245
In Stock :
47,245

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Manufacturer :
Texas Instruments
Product Category :
DSP (Digital Signal Processors)
Non-Volatile Memory :
ROM (32kB)
Supplier Device Package :
240-BGA MICROSTAR (15x15)
Clock Rate :
200MHz
RoHS :
Non-Compliant
Interface :
Host Interface, McBSP
Package :
Tray
Type :
FIXED POINT
Product Status :
Obsolete
Operating Temperature :
-40°C ~ 85°C (TC)
Voltage - I/O :
3.30V
Series :
-
Mounting Type :
Surface Mount
Package / Case :
240-LFBGA
Voltage - Core :
1.60V
Datasheets
TMSDVC5510AGGWA2
Introducing DSP (Digital Signal Processors) Texas Instruments TMSDVC5510AGGWA2 from Chip IC,where excellence meets affordability. This product stands out with its Type:FIXED POINT, Operating Temperature:-40°C ~ 85°C (TC), Mounting Type:Surface Mount, Package / Case:240-LFBGA, TMSDVC5510AGGWA2 pinout, TMSDVC5510AGGWA2 datasheet PDF, TMSDVC5510AGGWA2 amp .Beyond DSP (Digital Signal Processors) Texas Instruments TMSDVC5510AGGWA2 ,we also offer TMS320VC5416PGE160, TMS320C6713BZDP300, ADSP-21369KBPZ-3A, Our vast inventory has you covered. Contact us now for immediate solutions.

Texas Instruments TMSDVC5510AGGWA2


DSP Texas Instruments TMSDVC5510AGGWA2 Overview

The DSP Texas Instruments TMSDVC5510AGGWA2 IC is a state-of-the-art digital signal processor designed for high-performance applications requiring fixed-point arithmetic. As a product crafted by the renowned Texas Instruments, this IC excels in delivering efficient, robust, and reliable signal processing capabilities. Its compact BGA (Ball Grid Array) packaging ensures a reduced footprint while enhancing the thermal and electrical performance, making it an ideal choice for demanding embedded applications. The TMSDVC5510AGGWA2 is specifically engineered to meet the rigorous needs of modern digital signal processing tasks where space and power efficiency are crucial.

TMSDVC5510AGGWA2 Features

This IC boasts a variety of features that make it highly suitable for a wide range of applications. Key features include a high-performance digital signal processing core, advanced power management capabilities that minimize power consumption during full operation, and a high degree of integration which reduces the need for additional external components. Furthermore, the DSP is equipped with multiple interfaces for enhanced connectivity options, supporting a variety of peripherals and enabling easier integration into existing systems.

TMSDVC5510AGGWA2 Applications

  • Audio Processing Equipment: Utilizes its high-speed signal processing capabilities to manage and enhance audio signals in professional audio systems, ensuring crisp and clear sound quality.
  • Automotive Electronics: Acts as the core processing unit in advanced driver-assistance systems (ADAS), handling complex algorithms for real-time vehicle monitoring and response systems.
  • Medical Imaging Devices: Applies its robust processing power to handle the computation-heavy tasks required for real-time medical imaging, such as ultrasound and MRI.
  • Telecommunications: Used in communication infrastructure to process vast amounts of data rapidly, ensuring efficient and reliable data transfer across networks.
  • Industrial Control Systems: Empowers industrial automation by processing multiple sensor inputs and controlling actuators in real-time, crucial for maintaining high precision and operational efficiency in manufacturing environments.
This HTML content provides a detailed overview, feature list, and applicable scenarios for the DSP Texas Instruments TMSDVC5510AGGWA2, highlighting its versatility and suitability for various high-demand applications.
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