TMSDVC5510AGBCA2

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Mfr.Part #
TMSDVC5510AGBCA2
Manufacturer
Texas Instruments
Package / Case
240-LFBGA
Datasheet
Download
Description
IC DSP FIXED POINT BGA
Stock
2,708
In Stock :
2,708

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Manufacturer :
Texas Instruments
Product Category :
DSP (Digital Signal Processors)
Product Status :
Active
Mounting Type :
Surface Mount
Series :
-
Package / Case :
240-LFBGA
Supplier Device Package :
240-NFBGA (15x15)
Operating Temperature :
-40°C ~ 85°C (TC)
Voltage - Core :
1.60V
Voltage - I/O :
3.30V
Base Product Number :
TMSDVC5510
Interface :
Host Interface, McBSP
Clock Rate :
200MHz
Non-Volatile Memory :
ROM (32kB)
Package :
Tray
Type :
FIXED POINT
Datasheets
TMSDVC5510AGBCA2
Introducing DSP (Digital Signal Processors) Texas Instruments TMSDVC5510AGBCA2 from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Package / Case:240-LFBGA, Operating Temperature:-40°C ~ 85°C (TC), Type:FIXED POINT, TMSDVC5510AGBCA2 pinout, TMSDVC5510AGBCA2 datasheet PDF, TMSDVC5510AGBCA2 amp .Beyond DSP (Digital Signal Processors) Texas Instruments TMSDVC5510AGBCA2 ,we also offer TMS320VC5416PGE160, TMS320C6713BZDP300, ADSP-21369KBPZ-3A, Our vast inventory has you covered. Contact us now for immediate solutions.

Texas Instruments TMSDVC5510AGBCA2


DSP Texas Instruments TMSDVC5510AGBCA2 Overview

The DSP Texas Instruments TMSDVC5510AGBCA2 is a cutting-edge integrated circuit designed specifically for fixed-point digital signal processing applications. Manufactured by Texas Instruments, a leader in semiconductor innovation, this IC leverages advanced technology to offer robust performance in signal manipulation and processing tasks. With its BGA (Ball Grid Array) packaging, the TMSDVC5510AGBCA2 ensures a reliable and efficient thermal management, making it ideal for high-performance, space-constrained applications. This product is specifically tailored to meet the demands of industries requiring precise and efficient signal processing capabilities, such as audio processing, telecommunications, and industrial control systems.

TMSDVC5510AGBCA2 Features

The TMSDVC5510AGBCA2 DSP offers several distinctive features that make it highly suitable for a broad range of applications. These include its high-speed processing capabilities, low power consumption, and the ability to handle complex algorithms efficiently. The device's architecture is designed to maximize data throughput and minimize latency, providing optimal performance in real-time processing environments.

TMSDVC5510AGBCA2 Applications

  • Audio Processing: Utilizes its high-speed signal processing capabilities to manage and improve sound quality in systems like digital mixing consoles and audio DSPs.
  • Telecommunications: Employs advanced algorithms to facilitate data transmission and reception, enhancing both the speed and reliability of network communications.
  • Industrial Control: Adapts to various sensor inputs, processing signals in real-time to control and monitor industrial machinery effectively.
  • Automotive Systems: Supports advanced driver-assistance systems (ADAS) by processing inputs from multiple sensors for real-time decision making.
  • Medical Devices: Capable of handling complex computations for medical imaging techniques, improving diagnostic accuracies.
This HTML content encapsulates a comprehensive overview, distinct features, and specific applications of the Texas Instruments TMSDVC5510AGBCA2 DSP, designed to cater to B2B customers looking to integrate advanced DSP technology into their products.
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