TMSDM6467CCUT7TAN

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Mfr.Part #
TMSDM6467CCUT7TAN
Manufacturer
Texas Instruments
Package / Case
529-BFBGA, FCBGA
Datasheet
Download
Description
IC SOC DIGITAL MEDIA 529FCBGA
Stock
1
In Stock :
1

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Manufacturer :
Texas Instruments
Product Category :
DSP (Digital Signal Processors)
Base Part Number :
TMSDM6467
Thickness :
2.65mm
Number of Pins :
529
Supply Voltage :
1.2V
Width :
19mm
Terminal Position :
BOTTOM
Peak Reflow Temperature (Cel) :
245
Mounting Type :
Surface Mount
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Supply Voltage-Min (Vsup) :
1.14V
Clock Rate :
729MHz DSP, 364.5MHz ARM®
Non-Volatile Memory :
ROM (8kB)
Number of Terminations :
529
JESD-609 Code :
e1
Voltage - Core :
1.20V
Terminal Form :
Ball
Terminal Pitch :
0.8mm
Supply Voltage-Max (Vsup) :
1.26V
On Chip Data RAM :
248kB
RoHS Status :
ROHS3 Compliant
Mount :
Surface Mount
Pbfree Code :
yes
Interface :
EBI/EMI, Ethernet, HPI, I2C, McASP, PCI, SPI, UART, USB
Lifecycle Status :
ACTIVE (Last Updated: 2 days ago)
Series :
TMS320DM646x, DaVinci™
Voltage - I/O :
1.8V 3.3V
Packaging :
Tray
Frequency :
364.5MHz
Operating Temperature :
0°C~85°C TC
Length :
19mm
Number of UART Channels :
3
Terminal Finish :
Tin/Silver/Copper (Sn/Ag/Cu)
Package / Case :
529-BFBGA, FCBGA
Lead Free :
Lead Free
Type :
Digital Media System-on-Chip (DMSoC)
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Datasheets
TMSDM6467CCUT7TAN
Introducing DSP (Digital Signal Processors) Texas Instruments TMSDM6467CCUT7TAN from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:TMSDM6467, Number of Pins:529, Mounting Type:Surface Mount, Number of Terminations:529, Operating Temperature:0°C~85°C TC, Package / Case:529-BFBGA, FCBGA, Type:Digital Media System-on-Chip (DMSoC), TMSDM6467CCUT7TAN pinout, TMSDM6467CCUT7TAN datasheet PDF, TMSDM6467CCUT7TAN amp .Beyond DSP (Digital Signal Processors) Texas Instruments TMSDM6467CCUT7TAN ,we also offer TMS320VC5416PGE160, TMS320C6713BZDP300, ADSP-21369KBPZ-3A, Our vast inventory has you covered. Contact us now for immediate solutions.

Texas Instruments TMSDM6467CCUT7TAN


DSP Texas Instruments TMSDM6467CCUT7TAN Overview

The DSP Texas Instruments TMSDM6467CCUT7TAN is a state-of-the-art IC SOC (System on Chip) designed for advanced digital media applications. This highly integrated device is engineered to handle complex digital signal processing tasks efficiently, making it an ideal choice for manufacturers aiming to enhance multimedia performance. With its high-speed processing capabilities and robust architecture, the TMSDM6467CCUT7TAN excels in delivering superior performance for audio and video processing, ensuring smooth and reliable operation in demanding environments. The inclusion of this IC in your product lineup not only elevates media processing capabilities but also offers scalability and flexibility in design, fostering innovation in next-generation digital media products.

TMSDM6467CCUT7TAN Features

The Texas Instruments TMSDM6467CCUT7TAN offers a plethora of features suited for high-demand digital signal processing. This includes dual-core architecture that combines general-purpose processing with DSP for maximum efficiency. Its 529-pin FCBGA package ensures a compact form factor while providing the necessary I/O capabilities for comprehensive multimedia applications. The IC also supports a range of video and audio codecs, facilitating easy integration into various digital media systems.

TMSDM6467CCUT7TAN Applications

  • Home Theater Systems: Enhances audio and video decoding capabilities, ensuring high-definition media playback with exceptional clarity and sound quality.
  • Professional Audio/Video Equipment: Utilized in the processing of high-quality audio and video streams, providing robust solutions for studio and live event applications.
  • Surveillance Systems: Employs advanced image processing techniques to improve video quality and compression in security and surveillance setups.
  • Broadcast Equipment: Ideal for real-time video processing and broadcasting, ensuring seamless stream quality and reliability.
  • Telecommunication Infrastructure: Supports enhanced signal processing capabilities for telecommunication networks, improving data throughput and network efficiency.
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