TMS320VC5501GZZ300
- Mfr.Part #
- TMS320VC5501GZZ300
- Manufacturer
- Texas Instruments
- Package / Case
- BGA
- Datasheet
- Download
- Description
- IC FXD-PNT DSP 600 MIPS 201-BGA
- Stock
- 6,482
- In Stock :
- 6,482
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- Manufacturer :
- Texas Instruments
- Product Category :
- DSP (Digital Signal Processors)
- Height :
- 1.4mm
- Terminal Position :
- BOTTOM
- Thickness :
- 900μm
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Data Bus Width :
- 32b
- Interface :
- I2C, UART
- Supply Voltage :
- 1.26V
- Additional Feature :
- ALSO REQUIRES 3.3V SUPPLY
- Number of Bits :
- 32
- Packaging :
- Bulk
- Min Operating Temperature :
- -40°C
- Length :
- 15mm
- Max Supply Voltage :
- 3.6V
- RAM Size :
- 32kB
- Memory Size :
- 32kB
- Max Operating Temperature :
- 85°C
- Min Supply Voltage :
- 1.2V
- Peak Reflow Temperature (Cel) :
- 220
- RoHS Status :
- RoHS Compliant
- Mount :
- Surface Mount
- Frequency :
- 300MHz
- Internal Bus Architecture :
- Multiple
- Width :
- 15mm
- Number of Terminations :
- 201
- Operating Supply Voltage :
- 1.26V
- Pin Count :
- 201
- Number of Pins :
- 201
- uPs/uCs/Peripheral ICs Type :
- DIGITAL SIGNAL PROCESSOR, OTHER
- Terminal Form :
- Ball
- Format :
- FIXED POINT
- Low Power Mode :
- yes
- Number of External Interrupts :
- 4
- JESD-609 Code :
- e0
- Barrel Shifter :
- No
- Number of Programmable I/O :
- 8
- Number of UART Channels :
- 1
- Package / Case :
- BGA
- Memory Type :
- EPROM, SDRAM, SRAM
- Frequency (Max) :
- 300MHz
- Weight :
- 490.701896mg
- Bit Size :
- 16
- Lead Free :
- Contains Lead
- ROM Programmability :
- MROM
- Boundary Scan :
- yes
- Terminal Finish :
- Tin/Lead (Sn/Pb)
- Supply Current-Max :
- 239mA
- Radiation Hardening :
- No
- Temperature Grade :
- Industrial
- Number of Timers :
- 4
- Lifecycle Status :
- NRND (Last Updated: 3 days ago)
- Integrated Cache :
- yes
- Datasheets
- TMS320VC5501GZZ300

DSP Texas Instruments TMS320VC5501GZZ300 Overview
The DSP Texas Instruments TMS320VC5501GZZ300 is a highly capable fixed-point digital signal processor designed to meet the rigorous demands of modern signal processing applications. Engineered by Texas Instruments, a leader in semiconductor technology, this IC delivers powerful performance with its capability to process up to 600 million instructions per second (MIPS). This processor is encased in a 201-ball grid array (BGA) package, ensuring a compact footprint while providing robust functionality for complex algorithms and processing tasks. Ideal for embedded applications requiring high-speed numeric calculations and real-time processing, the TMS320VC5501GZZ300 combines efficiency with high-performance capabilities, making it a preferred choice for industry professionals looking for reliable and scalable processing solutions.
TMS320VC5501GZZ300 Features
This DSP chip stands out with its high MIPS throughput, providing robust processing power needed for demanding applications. Its 201-BGA packaging not only minimizes space on the hardware layout but also enhances thermal management and reliability in rigorous operational conditions. Furthermore, the TMS320VC5501GZZ300 supports a variety of peripherals and interfaces, offering designers flexibility in system integration and functionality enhancements.
TMS320VC5501GZZ300 Applications
- Audio Processing: Utilized in high-fidelity audio systems for effects processing and sound enhancement, delivering clearer and richer audio output.
- Industrial Control Systems: Employs complex algorithms for real-time process control in manufacturing environments, ensuring precise and efficient operations.
- Telecommunications: Integral in handling signal processing tasks for data transmission and reception, enhancing communication reliability and speed.
- Medical Imaging Systems: Processes large datasets in medical imaging equipment such as ultrasound and MRI machines, improving image resolution and diagnostic accuracy.
- Automotive: Used in automotive safety and navigation systems to process and respond to real-time sensor data, increasing vehicle safety and driving assistance capabilities.
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