S29GL256P11FFIV13

Manufacturer :

Infineon Technologies

Product Category :

Memory

Length :

13mm

Height Seated (Max) :

1.4mm

Toggle Bit :

yes

Memory Interface :

Parallel

Terminal Finish :

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Number of Pins :

64

Write Cycle Time - Word, Page :

110ns

Operating Temperature :

-40°C~85°C TA

HTS Code :

8542.32.00.51

Number of Sectors/Size :

256

Factory Lead Time :

16 Weeks

Memory Size :

256Mb 32M x 8

Time@Peak Reflow Temperature-Max (s) :

40

Ready/Busy :

yes

Standby Current-Max :

0.000005A

Terminal Pitch :

1mm

Number of Functions :

1

Access Time (Max) :

110 ns

Peak Reflow Temperature (Cel) :

260

RoHS Status :

ROHS3 Compliant

Data Polling :

yes

Supply Current-Max :

0.11mA

Supply Voltage-Min (Vsup) :

2.7V

Package / Case :

64-LBGA

Alternate Memory Width :

8

Packaging :

Tape and Reel (TR)

Mounting Type :

Surface Mount

Surface Mount :

yes

Sector Size :

128K

Density :

256 Mb

Width :

11mm

Command User Interface :

yes

Radiation Hardening :

No

JESD-609 Code :

e1

Supply Voltage-Max (Vsup) :

3.6V

Power Supplies :

1.8/3.33/3.3V

Series :

GL-P

Memory Width :

1

Programming Voltage :

3V

Memory Format :

Flash

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Number of Terminations :

64

Voltage - Supply :

1.65V~3.6V

Common Flash Interface :

yes

Organization :

256MX1

Memory Type :

Non-Volatile

Page Size :

8/16words

ECCN Code :

3A991.B.1.A

Supply Voltage :

3V

Terminal Position :

BOTTOM