S29GL256P11FFI023

Manufacturer :

Infineon Technologies

Product Category :

Memory

HTS Code :

8542.32.00.51

Number of Terminations :

64

Terminal Finish :

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Voltage - Supply :

2.7V~3.6V

Density :

256 Mb

Programming Voltage :

3V

Height Seated (Max) :

1.4mm

Lead Free :

Lead Free

Sector Size :

128K

Supply Voltage :

3V

Number of Functions :

1

Page Size :

8/16words

Number of Sectors/Size :

256

Memory Format :

Flash

Toggle Bit :

yes

Ready/Busy :

yes

JESD-609 Code :

e1

Supply Voltage-Max (Vsup) :

3.6V

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Memory Type :

Non-Volatile

Common Flash Interface :

yes

Mount :

Surface Mount

Number of Pins :

64

Data Bus Width :

8B

Nominal Supply Current :

110mA

Memory Width :

1

Power Supplies :

3/3.3V

Published :

2008

Terminal Pitch :

1mm

RoHS Status :

ROHS3 Compliant

Radiation Hardening :

No

Supply Voltage-Min (Vsup) :

2.7V

Data Polling :

yes

Memory Size :

256Mb 32M x 8

Packaging :

Tape and Reel (TR)

Mounting Type :

Surface Mount

Standby Current-Max :

0.000005A

Write Cycle Time - Word, Page :

110ns

Factory Lead Time :

16 Weeks

Operating Temperature :

-40°C~85°C TA

Peak Reflow Temperature (Cel) :

260

Command User Interface :

yes

Memory Interface :

Parallel

Length :

13mm

Package / Case :

64-LBGA

Terminal Position :

BOTTOM

ECCN Code :

3A991.B.1.A

Series :

GL-P

Organization :

256MX1

Access Time (Max) :

110 ns

Sync/Async :

ASYNCHRONOUS

Time@Peak Reflow Temperature-Max (s) :

40

Alternate Memory Width :

8