S29GL256P11FFI010

Manufacturer :

Infineon Technologies

Product Category :

Memory

Number of Functions :

1

Length :

13mm

Memory Format :

Flash

Number of Terminations :

64

Radiation Hardening :

No

Operating Temperature :

-40°C~85°C TA

Published :

2012

REACH SVHC :

No SVHC

Contact Plating :

Copper, Silver, Tin

Terminal Pitch :

1mm

Number of Pins :

64

Data Bus Width :

8B

Nominal Supply Current :

110mA

Common Flash Interface :

yes

Memory Width :

1

Terminal Finish :

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Ready/Busy :

yes

Package / Case :

64-LBGA

HTS Code :

8542.32.00.51

Supply Voltage-Min (Vsup) :

2.7V

Sector Size :

128K

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Supply Voltage :

3V

Time@Peak Reflow Temperature-Max (s) :

40

ECCN Code :

3A991.B.1.A

Data Polling :

yes

Memory Interface :

Parallel

Voltage - Supply :

2.7V~3.6V

Mounting Type :

Surface Mount

Write Cycle Time - Word, Page :

110ns

Series :

GL-P

Number of Sectors/Size :

256

Sync/Async :

ASYNCHRONOUS

Memory Type :

Non-Volatile

Mount :

Surface Mount

RoHS Status :

ROHS3 Compliant

Standby Current-Max :

0.000005A

Memory Size :

256Mb 32M x 8

Page Size :

8/16words

Alternate Memory Width :

8

Toggle Bit :

yes

Lead Free :

Lead Free

Programming Voltage :

3V

Access Time (Max) :

110 ns

Terminal Position :

BOTTOM

Power Supplies :

3/3.3V

Factory Lead Time :

16 Weeks

Organization :

256MX1

JESD-609 Code :

e1

Peak Reflow Temperature (Cel) :

260

Density :

256 Mb

Height Seated (Max) :

1.4mm

Packaging :

Tray

Command User Interface :

yes

Supply Voltage-Max (Vsup) :

3.6V