S29GL256P10FFI022

Manufacturer :

Infineon Technologies

Product Category :

Memory

Access Time (Max) :

100 ns

Qualification Status :

Not Qualified

Supply Voltage :

3V

Density :

256 Mb

RoHS Status :

ROHS3 Compliant

Programming Voltage :

3V

Published :

2003

Organization :

256MX1

Common Flash Interface :

yes

Peak Reflow Temperature (Cel) :

260

Command User Interface :

yes

Operating Temperature :

-40°C~85°C TA

Package / Case :

64-LBGA

HTS Code :

8542.32.00.51

Factory Lead Time :

16 Weeks

Memory Format :

Flash

Series :

GL-P

Terminal Finish :

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Terminal Pitch :

1mm

Data Bus Width :

8B

Memory Size :

256Mb 32M x 8

Voltage - Supply :

2.7V~3.6V

Data Polling :

yes

Sync/Async :

ASYNCHRONOUS

Packaging :

Tape and Reel (TR)

Toggle Bit :

yes

Supply Voltage-Min (Vsup) :

2.7V

Mount :

Surface Mount

Mounting Type :

Surface Mount

Number of Sectors/Size :

256

Memory Interface :

Parallel

Nominal Supply Current :

110mA

Number of Functions :

1

Sector Size :

128K

Memory Type :

Non-Volatile

Number of Terminations :

64

Alternate Memory Width :

8

Ready/Busy :

yes

Length :

13mm

Number of Pins :

64

Terminal Position :

BOTTOM

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Height Seated (Max) :

1.4mm

Supply Voltage-Max (Vsup) :

3.6V

Standby Current-Max :

0.000005A

Write Cycle Time - Word, Page :

100ns

JESD-609 Code :

e1

Page Size :

8/16words

Power Supplies :

3/3.3V

Memory Width :

1

Time@Peak Reflow Temperature-Max (s) :

40

ECCN Code :

3A991.B.1.A