S29GL256P10FFI020

Manufacturer :

Infineon Technologies

Product Category :

Memory

Data Polling :

yes

Peak Reflow Temperature (Cel) :

260

Terminal Finish :

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Voltage - Supply :

2.7V~3.6V

Memory Type :

Non-Volatile

Common Flash Interface :

yes

Memory Size :

256Mb 32M x 8

Ready/Busy :

yes

Access Time (Max) :

100 ns

Alternate Memory Width :

8

Supply Voltage-Min (Vsup) :

2.7V

Power Supplies :

3/3.3V

Contact Plating :

Copper, Silver, Tin

Memory Interface :

Parallel

Length :

13mm

Published :

2012

Command User Interface :

yes

Memory Format :

Flash

JESD-609 Code :

e1

Density :

256 Mb

Terminal Pitch :

1mm

Time@Peak Reflow Temperature-Max (s) :

40

Supply Voltage :

3V

Series :

GL-P

Radiation Hardening :

No

RoHS Status :

ROHS3 Compliant

Terminal Position :

BOTTOM

Write Cycle Time - Word, Page :

100ns

Number of Pins :

64

Mount :

Surface Mount

HTS Code :

8542.32.00.51

Package / Case :

64-LBGA

Organization :

256MX1

Memory Width :

1

Operating Temperature :

-40°C~85°C TA

Standby Current-Max :

0.000005A

Mounting Type :

Surface Mount

ECCN Code :

3A991.B.1.A

Sync/Async :

ASYNCHRONOUS

Toggle Bit :

yes

Page Size :

8/16words

Number of Functions :

1

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Supply Voltage-Max (Vsup) :

3.6V

Height Seated (Max) :

1.4mm

Data Bus Width :

8B

Programming Voltage :

3V

Sector Size :

128K

Number of Terminations :

64

Factory Lead Time :

16 Weeks

Number of Sectors/Size :

256

Nominal Supply Current :

110mA

Packaging :

Tray