S29GL256P10FFI010

Manufacturer :

Infineon Technologies

Product Category :

Memory

Sync/Async :

ASYNCHRONOUS

Length :

13mm

Memory Format :

Flash

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Package / Case :

64-LBGA

Number of Sectors/Size :

256

Published :

2012

Write Cycle Time - Word, Page :

100ns

JESD-609 Code :

e1

Organization :

256MX1

Command User Interface :

yes

Density :

256 Mb

Series :

GL-P

Number of Functions :

1

Nominal Supply Current :

110mA

Time@Peak Reflow Temperature-Max (s) :

40

Ready/Busy :

yes

Supply Voltage :

3V

Data Polling :

yes

Common Flash Interface :

yes

Peak Reflow Temperature (Cel) :

260

Memory Width :

1

Page Size :

8/16words

Access Time (Max) :

100 ns

Toggle Bit :

yes

Power Supplies :

3/3.3V

Voltage - Supply :

2.7V~3.6V

Mount :

Surface Mount

Terminal Position :

BOTTOM

Radiation Hardening :

No

Data Bus Width :

8B

Operating Temperature :

-40°C~85°C TA

Terminal Finish :

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Programming Voltage :

3V

Terminal Pitch :

1mm

Alternate Memory Width :

8

Memory Type :

Non-Volatile

Lead Free :

Lead Free

Height Seated (Max) :

1.4mm

Factory Lead Time :

16 Weeks

Sector Size :

128K

HTS Code :

8542.32.00.51

Standby Current-Max :

0.000005A

REACH SVHC :

No SVHC

Mounting Type :

Surface Mount

Supply Voltage-Max (Vsup) :

3.6V

Packaging :

Tray

Memory Size :

256Mb 32M x 8

Supply Voltage-Min (Vsup) :

2.7V

Number of Pins :

64

Memory Interface :

Parallel

RoHS Status :

ROHS3 Compliant

Number of Terminations :

64

Contact Plating :

Copper, Silver, Tin