S29GL128S10DHIV23

Manufacturer :

Infineon Technologies

Product Category :

Memory

ECCN Code :

3A991.B.1.A

Density :

128 Mb

Word Size :

16b

Operating Temperature :

-40°C~85°C TA

HTS Code :

8542.32.00.51

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Toggle Bit :

yes

JESD-609 Code :

e1

Terminal Finish :

Tin/Silver/Copper (Sn/Ag/Cu)

Number of Pins :

64

Supply Voltage :

3V

RoHS Status :

ROHS3 Compliant

Memory Type :

Non-Volatile

Sync/Async :

ASYNCHRONOUS

Access Time :

100ns

Series :

GL-S

Power Supplies :

3/3.3V

Length :

9mm

Mount :

Surface Mount

Voltage - Supply :

1.65V~3.6V

Nominal Supply Current :

60mA

Supply Voltage-Max (Vsup) :

3.6V

Page Size :

16words

Ready/Busy :

yes

Memory Format :

Flash

Peak Reflow Temperature (Cel) :

260

Memory Interface :

Parallel

Data Polling :

yes

Command User Interface :

yes

Write Cycle Time - Word, Page :

60ns

Programming Voltage :

3V

Common Flash Interface :

yes

Terminal Position :

BOTTOM

Terminal Pitch :

1mm

Supply Voltage-Min (Vsup) :

2.7V

Number of Functions :

1

Factory Lead Time :

13 Weeks

Height Seated (Max) :

1.4mm

Qualification Status :

Not Qualified

Number of Terminations :

64

Standby Current-Max :

0.0001A

Number of Sectors/Size :

128

Time@Peak Reflow Temperature-Max (s) :

NOT SPECIFIED

Memory Width :

8

Boot Block :

BOTTOM/TOP

Memory Size :

128Mb 8M x 16

Mounting Type :

Surface Mount

Packaging :

Tape and Reel (TR)

Address Bus Width :

23b

Package / Case :

64-LBGA

Organization :

16MX8

Sector Size :

64K