S29GL128P11TFIV23

Manufacturer :

Infineon Technologies

Product Category :

Memory

Packaging :

Tape and Reel (TR)

Length :

18.4mm

Radiation Hardening :

No

Voltage - Supply :

1.65V~3.6V

Number of Terminations :

56

Terminal Pitch :

0.5mm

Package / Case :

56-TFSOP (0.724, 18.40mm Width)

Terminal Position :

Dual

Organization :

128MX1

Factory Lead Time :

12 Weeks

Peak Reflow Temperature (Cel) :

260

JESD-30 Code :

R-PDSO-G56

Supply Current-Max :

0.11mA

Mounting Type :

Surface Mount

Memory Size :

128Mb 16M x 8

Memory Format :

Flash

Standby Current-Max :

0.000005A

Ready/Busy :

yes

Alternate Memory Width :

8

Series :

GL-P

Density :

128 Mb

Supply Voltage-Max (Vsup) :

3.6V

Operating Temperature :

-40°C~85°C TA

JESD-609 Code :

e3

Supply Voltage :

3V

Terminal Finish :

Matte Tin (Sn)

Page Size :

8/16words

Width :

14mm

Sector Size :

128K

Command User Interface :

yes

ECCN Code :

3A991.B.1.A

Write Cycle Time - Word, Page :

110ns

Number of Sectors/Size :

128

Common Flash Interface :

yes

Supply Voltage-Min (Vsup) :

2.7V

Toggle Bit :

yes

Power Supplies :

1.8/3.33/3.3V

Memory Width :

1

Memory Type :

Non-Volatile

Memory Interface :

Parallel

Number of Functions :

1

HTS Code :

8542.32.00.51

Surface Mount :

yes

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Access Time (Max) :

110 ns

Published :

2003

RoHS Status :

ROHS3 Compliant

Data Polling :

yes

Time@Peak Reflow Temperature-Max (s) :

40

Height Seated (Max) :

1.2mm

Programming Voltage :

3V