S29GL128P11FFI010

Manufacturer :

Infineon Technologies

Product Category :

Memory

Package / Case :

64-LBGA

HTS Code :

8542.32.00.51

Terminal Pitch :

1mm

Contact Plating :

Copper, Silver, Tin

Height Seated (Max) :

1.4mm

Memory Size :

128Mb 16M x 8

Voltage - Supply :

2.7V~3.6V

Time@Peak Reflow Temperature-Max (s) :

40

Memory Type :

Non-Volatile

Standby Current-Max :

0.000005A

JESD-609 Code :

e1

Number of Functions :

1

Mounting Type :

Surface Mount

Nominal Supply Current :

110mA

Page Size :

8/16words

Lead Free :

Lead Free

Toggle Bit :

yes

Radiation Hardening :

No

RoHS Status :

ROHS3 Compliant

Access Time (Max) :

110 ns

Sync/Async :

ASYNCHRONOUS

Density :

128 Mb

Memory Format :

Flash

Length :

13mm

Number of Pins :

64

Terminal Position :

BOTTOM

Supply Voltage :

3V

Number of Terminations :

64

Operating Supply Voltage :

3.6V

Operating Temperature :

-40°C~85°C TA

Data Bus Width :

8B

Data Polling :

yes

Alternate Memory Width :

8

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Programming Voltage :

3V

Write Cycle Time - Word, Page :

110ns

Memory Interface :

Parallel

Number of Sectors/Size :

128

Peak Reflow Temperature (Cel) :

260

Ready/Busy :

yes

Organization :

128MX1

Supply Voltage-Min (Vsup) :

2.7V

Command User Interface :

yes

Terminal Finish :

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Series :

GL-P

Common Flash Interface :

yes

Power Supplies :

3/3.3V

Factory Lead Time :

12 Weeks

Sector Size :

128K

Published :

2003

Mount :

Surface Mount

Packaging :

Tray

Memory Width :

1