S29GL032N90TFI033

Manufacturer :

Infineon Technologies

Product Category :

Memory

Packaging :

Tape and Reel (TR)

Data Polling :

yes

Published :

2015

Ready/Busy :

yes

Height Seated (Max) :

1.2mm

Package / Case :

48-TFSOP (0.724, 18.40mm Width)

Command User Interface :

yes

Width :

12mm

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Boot Block :

Top

Memory Type :

Non-Volatile

Standby Current-Max :

0.000005A

Contact Plating :

Tin

Organization :

2MX16

Operating Temperature :

-40°C~85°C TA

Memory Size :

32Mb 4M x 8 2M x 16

Supply Voltage :

3V

Memory Format :

Flash

Supply Voltage-Min (Vsup) :

2.7V

Supply Voltage-Max (Vsup) :

3.6V

Terminal Pitch :

0.5mm

Sync/Async :

ASYNCHRONOUS

Series :

GL-N

Radiation Hardening :

No

Time@Peak Reflow Temperature-Max (s) :

40

Page Size :

8/16words

RoHS Status :

ROHS3 Compliant

Memory Width :

16

ECCN Code :

3A991.B.1.A

Access Time (Max) :

90 ns

HTS Code :

8542.32.00.51

Write Cycle Time - Word, Page :

90ns

Mounting Type :

Surface Mount

Voltage - Supply :

2.7V~3.6V

Terminal Position :

Dual

Toggle Bit :

yes

Common Flash Interface :

yes

Factory Lead Time :

14 Weeks

Mount :

Surface Mount

Nominal Supply Current :

50mA

Programming Voltage :

3V

Number of Functions :

1

JESD-609 Code :

e3

Number of Terminations :

48

Sector Size :

8K64K

Length :

18.4mm

Power Supplies :

3/3.3V

Alternate Memory Width :

8

Density :

32 Mb

Number of Pins :

48

Peak Reflow Temperature (Cel) :

260

Number of Sectors/Size :

863

Memory Interface :

Parallel