MT57W1MH18JF-7.5

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Mfr.Part #
MT57W1MH18JF-7.5
Manufacturer
Micron Technology
Package / Case
165-TBGA
Datasheet
Download
Description
IC SRAM 18MBIT PARALLEL 165FBGA
Stock
58
In Stock :
58

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Manufacturer :
Micron Technology
Product Category :
Memory
Supplier Device Package :
165-FBGA (13x15)
Product Status :
Active
Seated Height-Max :
1.2 mm
Terminal Position :
BOTTOM
Terminal Finish :
TIN SILVER COPPER
JESD-30 Code :
R-PBGA-B165
Surface Mount :
yes
Number of Words :
1048576 words
Clock Frequency :
133 MHz
Additional Feature :
PIPELINED ARCHITECTURE
Memory Width :
18
Package Shape :
RECTANGULAR
Supply Voltage-Min (Vsup) :
1.7 V
Memory IC Type :
DDR SRAM
Voltage - Supply :
1.7V ~ 1.9V
Length :
15 mm
Package / Case :
165-TBGA
Package :
Bulk
Memory Type :
Volatile
Width :
13 mm
Memory Size :
18Mbit
RoHS :
Non-Compliant
Base Product Number :
MT57W1MH
JESD-609 Code :
e1
Organization :
1MX18
Number of Terminals :
165
Mounting Type :
Surface Mount
Temperature Grade :
COMMERCIAL
Access Time :
7.5 ns
Technology :
SRAM - DDR2
Terminal Pitch :
1 mm
Operating Temperature :
0°C ~ 70°C (TA)
Parallel/Serial :
Parallel
Series :
-
Number of Functions :
1
Terminal Form :
Ball
Memory Interface :
Parallel
Memory Organization :
1M x 18
Reach Compliance Code :
Unknown
Write Cycle Time - Word, Page :
-
Memory Format :
SRAM
Supply Voltage-Max (Vsup) :
1.9 V
Manufacturer :
Rochester Electronics LLC
Operating Mode :
SYNCHRONOUS
Pin Count :
165
Memory Density :
18874368 bit
Qualification Status :
COMMERCIAL
Datasheets
MT57W1MH18JF-7.5
Introducing Memory Micron Technology MT57W1MH18JF-7.5 from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:165-TBGA, Mounting Type:Surface Mount, Operating Temperature:0°C ~ 70°C (TA), MT57W1MH18JF-7.5 pinout, MT57W1MH18JF-7.5 datasheet PDF, MT57W1MH18JF-7.5 amp .Beyond Memory Micron Technology MT57W1MH18JF-7.5 ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Micron Technology MT57W1MH18JF-7.5


Memory Micron Technology MT57W1MH18JF-7.5 Overview

Introducing the cutting-edge Memory Micron Technology MT57W1MH18JF-7.5, a high-performance integrated circuit designed to revolutionize data storage and retrieval. This innovative IC SRAM 18MBIT Parallel 165FBGA offers unparalleled speed, reliability, and efficiency, making it the ideal solution for a wide range of industrial applications.

With its advanced parallel architecture and 18MBIT capacity, this memory module empowers systems to handle large volumes of data with lightning-fast responsiveness. Whether used in telecommunications, automotive, or aerospace industries, the Memory Micron Technology MT57W1MH18JF-7.5 delivers unmatched performance, ensuring seamless operation even in the most demanding environments.

Experience the next generation of memory technology with Memory Micron Technology MT57W1MH18JF-7.5 and unlock new possibilities for your business.

MT57W1MH18JF-7.5 Features

  • High-performance IC SRAM
  • 18MBIT capacity
  • Parallel architecture for enhanced data processing
  • Compact 165FBGA package for easy integration
  • Wide operating temperature range
  • Low power consumption
  • Robust reliability and durability

MT57W1MH18JF-7.5 Applications

  • Telecommunications: Utilized in network switches and routers for high-speed data buffering and caching, ensuring seamless communication and reduced latency.
  • Automotive: Integrated into advanced driver assistance systems (ADAS) for real-time processing of sensor data, enhancing vehicle safety and performance.
  • Aerospace: Deployed in avionics systems for critical mission data storage and retrieval, enabling reliable operation in extreme conditions.
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