MT57W1MH18JF-6
- Mfr.Part #
- MT57W1MH18JF-6
- Manufacturer
- Micron Technology
- Package / Case
- 165-TBGA
- Datasheet
- Download
- Description
- IC SRAM 18MBIT PARALLEL 165FBGA
- Stock
- 8,686
- In Stock :
- 8,686
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- * Fullname:
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- Manufacturer :
- Micron Technology
- Product Category :
- Memory
- Memory Size :
- 18Mbit
- Supply Voltage-Max (Vsup) :
- 1.9 V
- Memory Density :
- 18874368 bit
- Width :
- 13 mm
- Operating Temperature :
- 0°C ~ 70°C (TA)
- Supply Voltage-Min (Vsup) :
- 1.7 V
- Voltage - Supply :
- 1.7V ~ 1.9V
- Access Time :
- 6 ns
- Reach Compliance Code :
- Unknown
- Seated Height-Max :
- 1.2 mm
- Supplier Device Package :
- 165-FBGA (13x15)
- Surface Mount :
- yes
- Number of Functions :
- 1
- Additional Feature :
- PIPELINED ARCHITECTURE
- Pin Count :
- 165
- Memory Organization :
- 1M x 18
- Parallel/Serial :
- Parallel
- Terminal Finish :
- TIN SILVER COPPER
- Package :
- Bulk
- Base Product Number :
- MT57W1MH
- Clock Frequency :
- 167 MHz
- Memory Type :
- Volatile
- Organization :
- 1MX18
- Memory IC Type :
- DDR SRAM
- RoHS :
- Compliant
- JESD-609 Code :
- e1
- Terminal Form :
- Ball
- Series :
- -
- Manufacturer :
- Rochester Electronics LLC
- Memory Width :
- 18
- Memory Format :
- SRAM
- Terminal Position :
- BOTTOM
- Number of Words :
- 1048576 words
- Temperature Grade :
- COMMERCIAL
- Operating Mode :
- SYNCHRONOUS
- Package / Case :
- 165-TBGA
- Technology :
- SRAM - DDR2
- Length :
- 15 mm
- Package Shape :
- RECTANGULAR
- Qualification Status :
- COMMERCIAL
- Mounting Type :
- Surface Mount
- Write Cycle Time - Word, Page :
- -
- Product Status :
- Active
- JESD-30 Code :
- R-PBGA-B165
- Number of Terminals :
- 165
- Terminal Pitch :
- 1 mm
- Memory Interface :
- Parallel
- Datasheets
- MT57W1MH18JF-6

[Memory Micron Technology MT57W1MH18JF-6] Overview
Introducing the MT57W1MH18JF-6, a cutting-edge IC SRAM solution meticulously crafted by Micron Technology, a leader in semiconductor innovation. This 18MBIT Parallel 165FBGA marvelizes the landscape of memory integration, offering unparalleled performance and reliability.
Designed to exceed the demands of modern computing, this memory module embodies Micron's commitment to excellence, ensuring seamless operation in even the most demanding applications. Whether powering critical systems or enhancing data processing efficiency, this IC SRAM stands as a testament to Micron's dedication to technological advancement.
MT57W1MH18JF-6 Features
- High Capacity: With 18MBIT of storage capacity, this IC SRAM provides ample space for data storage and retrieval, ideal for applications requiring extensive memory resources.
- Parallel Interface: The parallel interface ensures rapid data transfer rates, enabling swift communication between the memory module and the host system.
- 165FBGA Package: Housed in a 165FBGA package, this memory module boasts a compact form factor, optimizing space utilization in densely populated PCB designs.
- Low Power Consumption: Despite its robust performance capabilities, this IC SRAM maintains energy efficiency, minimizing power consumption and reducing operational costs.
- Reliability: Built to stringent quality standards, this memory module delivers exceptional reliability, ensuring consistent performance in mission-critical applications.
MT57W1MH18JF-6 Applications
- Industrial Automation: Utilized in industrial automation systems, the MT57W1MH18JF-6 facilitates real-time data processing and control, enhancing operational efficiency in manufacturing environments.
- Telecommunications Infrastructure: Integrated within telecommunications infrastructure equipment, this memory module enables high-speed data buffering and routing, ensuring seamless communication networks.
- Medical Devices: Embedded in medical devices such as imaging systems and patient monitors, this IC SRAM supports rapid data storage and retrieval, enhancing diagnostic accuracy and patient care.
- Networking Equipment: Deployed in networking equipment such as routers and switches, the MT57W1MH18JF-6 accelerates data packet processing, improving network performance and reliability.
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