LFX200EB-04F256C

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Mfr.Part #
LFX200EB-04F256C
Manufacturer
Lattice Semiconductor
Package / Case
256-BGA
Datasheet
Download
Description
IC FPGA 160 I/O 256FBGA
Stock
39,025
In Stock :
39,025

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Manufacturer :
Lattice Semiconductor
Product Category :
FPGAs (Field Programmable Gate Array)
Length :
17mm
Time@Peak Reflow Temperature-Max (s) :
30
Number of I/O :
160
Terminal Pitch :
1mm
JESD-609 Code :
e0
Package / Case :
256-BGA
Power Supplies :
2.5/3.3V
Reach Compliance Code :
not_compliant
Additional Feature :
ALSO OPERATES WITH 3.3V SUPPLY
Voltage - Supply :
2.3V~3.6V
Lead Free :
Lead Free
Base Part Number :
LFX200
Supply Voltage :
2.5V
Number of Logic Elements/Cells :
2704
HTS Code :
8542.39.00.01
Width :
17mm
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Mount :
Surface Mount
Memory Size :
19.3kB
Height Seated (Max) :
2.1mm
Number of CLBs :
676
Operating Temperature :
0°C~85°C TJ
Series :
ispXPGA®
Qualification Status :
Not Qualified
RAM Size :
13.9kB
Number of Gates :
210000
Pin Count :
256
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Number of Pins :
256
Operating Supply Voltage :
2.5V
Number of Outputs :
160
Total RAM Bits :
113664
Peak Reflow Temperature (Cel) :
225
Terminal Form :
Ball
Packaging :
Tray
Mounting Type :
Surface Mount
Clock Frequency :
320MHz
ECCN Code :
EAR99
Pbfree Code :
No
RoHS Status :
Non-RoHS Compliant
Number of Terminations :
256
Terminal Finish :
Tin/Lead (Sn63Pb37)
Published :
2000
Terminal Position :
BOTTOM
Combinatorial Delay of a CLB-Max :
0.93 ns
Introducing FPGAs (Field Programmable Gate Array) Lattice Semiconductor LFX200EB-04F256C from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:256-BGA, Base Part Number:LFX200, Operating Temperature:0°C~85°C TJ, Number of Pins:256, Mounting Type:Surface Mount, Number of Terminations:256, LFX200EB-04F256C pinout, LFX200EB-04F256C datasheet PDF, LFX200EB-04F256C amp .Beyond FPGAs (Field Programmable Gate Array) Lattice Semiconductor LFX200EB-04F256C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Lattice Semiconductor LFX200EB-04F256C


FPGAs Lattice Semiconductor LFX200EB-04F256C Overview

The FPGAs Lattice Semiconductor LFX200EB-04F256C is a highly versatile field-programmable gate array designed for sophisticated, high-speed digital signal processing and embedded applications. This IC offers a seamless integration of power and functionality in a compact 256FBGA package, making it an ideal choice for designers looking to enhance system performance while reducing power consumption. With its 160 I/O pins, it supports a wide array of configurations and is perfectly suited for a range of industrial, automotive, and communication applications, thereby providing a scalable, flexible solution that meets the demands of modern electronic environments.

LFX200EB-04F256C Features

The Lattice Semiconductor LFX200EB-04F256C FPGA boasts a comprehensive set of features designed for robust performance and versatility:

  • High I/O Pin Count: Features 160 input/output pins, allowing for extensive connectivity with other components.
  • Compact Size: Housed in a 256-pin fine-pitch ball grid array (FBGA) package, it optimizes board space without compromising on functionality.
  • Low Power Consumption: Engineered to operate with reduced power requirements, which enhances efficiency in power-sensitive applications.
  • Programmable Logic: Offers customizable logic cell configurations that can be tailored to specific application needs, enabling more efficient processing and faster time to market.

LFX200EB-04F256C Applications

  • Automotive Driver Assistance Systems: Utilizes its processing power to manage real-time data from sensors and cameras, aiding in features like automatic braking and lane-keeping assistance.
  • Industrial Automation: Empowers industrial controllers to perform complex computing tasks for automation processes, improving operational efficiency and reliability.
  • Wireless Communication Systems: Supports the demanding processing needs of modern communication infrastructures, including base station development and network management.
  • Consumer Electronics: Provides the backbone for innovative consumer electronics, such as smart home devices and high-performance portable gadgets, through its flexible I/O configuration and low power consumption.
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