LFX200EB-03F256C

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Mfr.Part #
LFX200EB-03F256C
Manufacturer
Lattice Semiconductor
Package / Case
256-BGA
Datasheet
Download
Description
IC FPGA 160 I/O 256FBGA
Stock
9,352
In Stock :
9,352

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Manufacturer :
Lattice Semiconductor
Product Category :
FPGAs (Field Programmable Gate Array)
Length :
17mm
Terminal Form :
Ball
Reach Compliance Code :
not_compliant
Power Supplies :
2.5/3.3V
Pbfree Code :
No
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Terminal Position :
BOTTOM
RoHS Status :
Non-RoHS Compliant
Number of Gates :
210000
Mount :
Surface Mount
Pin Count :
256
Total RAM Bits :
113664
Number of Logic Elements/Cells :
2704
Base Part Number :
LFX200
Terminal Pitch :
1mm
Voltage - Supply :
2.3V~3.6V
Clock Frequency :
320MHz
Operating Temperature :
0°C~85°C TJ
Combinatorial Delay of a CLB-Max :
1.07 ns
Package / Case :
256-BGA
Number of Pins :
256
Qualification Status :
Not Qualified
RAM Size :
13.9kB
Memory Size :
19.3kB
HTS Code :
8542.39.00.01
ECCN Code :
EAR99
Number of Outputs :
160
Supply Voltage :
2.5V
Number of Terminations :
256
Series :
ispXPGA®
Additional Feature :
ALSO OPERATES WITH 3.3V SUPPLY
Terminal Finish :
Tin/Lead (Sn63Pb37)
Time@Peak Reflow Temperature-Max (s) :
30
Published :
2000
Peak Reflow Temperature (Cel) :
225
Mounting Type :
Surface Mount
Number of I/O :
160
Number of CLBs :
676
JESD-609 Code :
e0
Packaging :
Tray
Lead Free :
Lead Free
Height Seated (Max) :
2.1mm
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Operating Supply Voltage :
2.5V
Width :
17mm
Datasheets
LFX200EB-03F256C
Introducing FPGAs (Field Programmable Gate Array) Lattice Semiconductor LFX200EB-03F256C from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:LFX200, Operating Temperature:0°C~85°C TJ, Package / Case:256-BGA, Number of Pins:256, Number of Terminations:256, Mounting Type:Surface Mount, LFX200EB-03F256C pinout, LFX200EB-03F256C datasheet PDF, LFX200EB-03F256C amp .Beyond FPGAs (Field Programmable Gate Array) Lattice Semiconductor LFX200EB-03F256C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Lattice Semiconductor LFX200EB-03F256C


FPGAs Lattice Semiconductor LFX200EB-03F256C Overview

The LFX200EB-03F256C, a leading-edge FPGA from Lattice Semiconductor, is designed to meet the evolving demands of modern technology sectors. This FPGA combines versatility with performance, encapsulated in a compact 256FBGA package, making it ideal for sophisticated yet space-conscious applications. The integration of 160 I/O allows for robust connectivity options, enhancing system integration and scalability. Optimized for low-power consumption while maintaining high performance, the FPGAs Lattice Semiconductor LFX200EB-03F256C is the solution of choice for developers looking to push the boundaries of innovation in hardware design.

LFX200EB-03F256C Features

This FPGA model boasts a variety of features that cater to the needs of high-performance computing environments requiring reliable and flexible solutions. Key features include a dense 256-ball fine-pitch BGA package that supports a large number of I/O interfaces and a programmable fabric that allows for custom configurations tailored to specific application needs. The device's low-power architecture ensures efficient operation, reducing the overall energy cost and heat generation, making it suitable for energy-sensitive projects.

LFX200EB-03F256C Applications

  • Consumer Electronics: Used in smart home devices, gaming consoles, and wearable technology, where its ability to handle multiple inputs and outputs efficiently enhances user experience and functionality.
  • Industrial Automation: Integrated in systems requiring high levels of data processing and real-time execution such as robotics and assembly line sensors, improving operational efficiency and reliability.
  • Automotive Applications: Ideal for advanced driver-assistance systems (ADAS) and infotainment systems, providing the necessary processing power and connectivity to support real-time decision-making and multimedia processing.
  • Telecommunications: Employs in network infrastructure to facilitate high-speed data transmission and signal processing tasks, supporting the expansion of 5G and other advanced communication technologies.
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