LFX200EB-03FN256C
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- Mfr.Part #
- LFX200EB-03FN256C
- Manufacturer
- Lattice Semiconductor
- Package / Case
- 256-BGA
- Datasheet
- Download
- Description
- IC FPGA 160 I/O 256FBGA
- Stock
- 2
- In Stock ：
- 2
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- Manufacturer :
- Lattice Semiconductor
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Number of Pins :
- 256
- Number of Terminations :
- 256
- Width :
- 17mm
- Height Seated (Max) :
- 2.1mm
- Mount :
- Surface Mount
- Terminal Form :
- Ball
- ECCN Code :
- EAR99
- Terminal Pitch :
- 1mm
- Additional Feature :
- ALSO OPERATES WITH 3.3V SUPPLY
- Number of CLBs :
- 676
- HTS Code :
- 8542.39.00.01
- Power Supplies :
- 2.5/3.3V
- Lead Free :
- Lead Free
- Clock Frequency :
- 320MHz
- RAM Size :
- 13.9kB
- Number of Outputs :
- 160
- Operating Temperature :
- 0°C~85°C TJ
- Packaging :
- Tray
- Voltage - Supply :
- 2.3V~3.6V
- Pbfree Code :
- yes
- JESD-609 Code :
- e1
- Memory Size :
- 19.3kB
- Published :
- 2000
- RoHS Status :
- RoHS Compliant
- Number of Logic Elements/Cells :
- 2704
- Base Part Number :
- LFX200
- Pin Count :
- 256
- Number of Gates :
- 210000
- Series :
- ispXPGA®
- Length :
- 17mm
- Operating Supply Voltage :
- 2.5V
- Radiation Hardening :
- No
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Total RAM Bits :
- 113664
- Combinatorial Delay of a CLB-Max :
- 1.07 ns
- Package / Case :
- 256-BGA
- Mounting Type :
- Surface Mount
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- Supply Voltage :
- 2.5V
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Terminal Position :
- BOTTOM
- Number of I/O :
- 160
- Datasheets
- LFX200EB-03FN256C
FPGAs Lattice Semiconductor LFX200EB-03FN256C Overview
Introducing the LFX200EB-03FN256C from Lattice Semiconductor, a high-performance FPGA designed to meet the demanding needs of modern digital applications. This device is part of Lattice Semiconductor's renowned FPGA product line, which offers a versatile platform for developing complex digital circuits with increased flexibility and speed. The LFX200EB-03FN256C is built to support intricate digital processing tasks, featuring a robust 256FBGA package that facilitates efficient thermal management and compact PCB design. The FPGA's architecture allows for rapid prototyping and mass deployment in a wide range of industries, making it a go-to solution for engineers looking to innovate and enhance system performance.
LFX200EB-03FN256C Features
The LFX200EB-03FN256C FPGA offers a comprehensive set of features that make it an ideal choice for a variety of applications. Key features include a high I/O count of 160, providing ample connectivity options for peripheral devices and other integrated circuits. The 256FBGA packaging not only ensures a compact footprint but also enhances the overall reliability and durability of the device. With its advanced programmable logic, the LFX200EB-03FN256C can be tailored to specific tasks, which increases its utility in complex digital environments.
LFX200EB-03FN256C Applications
- Telecommunications: Utilized in network infrastructure to manage signal processing and data flow, enhancing the performance and reliability of communication systems.
- Automotive Electronics: Employs advanced control systems for vehicle management, including sensor integration and real-time processing for autonomous driving features.
- Consumer Electronics: Integral to the development of consumer electronics such as smartphones and wearables, providing support for multiple functionalities while maintaining power efficiency.
- Industrial Automation: Used in control systems to increase the efficiency and precision of automated processes in manufacturing environments.
- Medical Devices: Supports the complex functionalities required in modern medical devices, ensuring rapid data processing and reliability essential for patient monitoring systems.
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