LFX200B-03F256C
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- Mfr.Part #
- LFX200B-03F256C
- Manufacturer
- Lattice Semiconductor
- Package / Case
- 256-BGA
- Datasheet
- Download
- Description
- IC FPGA 160 I/O 256FBGA
- Stock
- 16,097
- In Stock ：
- 16,097
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- Manufacturer :
- Lattice Semiconductor
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Length :
- 17mm
- Mounting Type :
- Surface Mount
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Number of Terminations :
- 256
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Terminal Form :
- Ball
- Pbfree Code :
- No
- Voltage - Supply :
- 2.3V~3.6V
- Number of CLBs :
- 676
- Additional Feature :
- ALSO OPERATES WITH 3.3V SUPPLY
- Package / Case :
- 256-BGA
- Total RAM Bits :
- 113664
- Terminal Position :
- BOTTOM
- RoHS Status :
- Non-RoHS Compliant
- JESD-609 Code :
- e0
- Peak Reflow Temperature (Cel) :
- 225
- Memory Size :
- 19.3kB
- Operating Supply Voltage :
- 2.5V
- Number of Pins :
- 256
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Power Supplies :
- 2.5/3.3V
- Number of Gates :
- 210000
- Mount :
- Surface Mount
- HTS Code :
- 8542.39.00.01
- Number of Logic Elements/Cells :
- 2704
- Terminal Pitch :
- 1mm
- Published :
- 2000
- Qualification Status :
- Not Qualified
- Reach Compliance Code :
- not_compliant
- Lead Free :
- Lead Free
- Pin Count :
- 256
- RAM Size :
- 13.9kB
- Height Seated (Max) :
- 2.1mm
- Clock Frequency :
- 320MHz
- Supply Voltage :
- 2.5V
- Combinatorial Delay of a CLB-Max :
- 1.07 ns
- Base Part Number :
- LFX200
- Number of Outputs :
- 160
- Terminal Finish :
- Tin/Lead (Sn63Pb37)
- Series :
- ispXPGA®
- Packaging :
- Tray
- Width :
- 17mm
- Number of I/O :
- 160
- ECCN Code :
- EAR99
- Operating Temperature :
- 0°C~85°C TJ
- Datasheets
- LFX200B-03F256C
FPGAs Lattice Semiconductor LFX200B-03F256C Overview
Introducing the LFX200B-03F256C from Lattice Semiconductor, a cutting-edge FPGA (Field Programmable Gate Array) designed for high-performance applications that require efficient and flexible hardware configurations. This versatile IC integrates 160 I/O pins within a compact 256FBGA package, making it an ideal solution for designers looking to balance functionality and board real estate. As part of the FPGAs Lattice Semiconductor LFX200B-03F256C category, this device embodies the innovation and reliability expected from a leading semiconductor manufacturer, providing robust options for customization and scalability. Its efficient architecture enables rapid prototyping and deployment across various industries, ensuring your designs meet both current and future demands.
LFX200B-03F256C Features
The LFX200B-03F256C boasts an array of features that stand out in the FPGA market. Key features include 160 programmable I/O pins that allow for versatile interfacing with a wide range of peripheral devices and multiple logic resources for implementing complex logic functions. The 256FBGA package is optimized for a reduced footprint, which is critical in space-constrained applications. Additionally, this FPGA offers high-speed performance and low power consumption, making it suitable for both portable and high-demand applications.
LFX200B-03F256C Applications
- Consumer Electronics: Utilized in devices such as smart TVs and gaming consoles, the LFX200B-03F256C enhances user interfaces and connectivity, providing a richer user experience.
- Automotive: Critical for driver assistance systems, this FPGA processes multiple inputs efficiently to deliver real-time responses, enhancing vehicle safety and performance.
- Industrial Automation: In manufacturing environments, the LFX200B-03F256C facilitates the control of robotic arms and automation processes, improving precision and productivity.
- Telecommunications: Essential for network equipment, this product supports high-speed data processing and improved signal integrity, which are pivotal in modern communication infrastructures.
- Medical Devices: Used in medical imaging systems, the FPGA supports complex algorithms for real-time image processing, contributing to advanced diagnostic capabilities.
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