IRFIZ46N
- Mfr.Part #
- IRFIZ46N
- Manufacturer
- Infineon Technologies
- Package / Case
- TO-220-3 Full Pack
- Datasheet
- Download
- Description
- MOSFET N-CH 55V 33A TO220AB FP
- Stock
- 1,262
- In Stock :
- 1,262
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Transistors - FETs, MOSFETs - Single
- Series :
- HEXFET®
- Power Dissipation-Max :
- 45W Tc
- DS Breakdown Voltage-Min :
- 55V
- Transistor Element Material :
- SILICON
- Avalanche Energy Rating (Eas) :
- 230 mJ
- Drive Voltage (Max Rds On,Min Rds On) :
- 10V
- Terminal Position :
- Single
- Surface Mount :
- No
- Package / Case :
- TO-220-3 Full Pack
- Operating Mode :
- ENHANCEMENT MODE
- Number of Terminations :
- 3
- Additional Feature :
- High Reliability
- Case Connection :
- Isolated
- Vgs(th) (Max) @ Id :
- 4V @ 250µA
- Number of Elements :
- 1
- Packaging :
- Tube
- Operating Temperature :
- -55°C~175°C TJ
- Vgs (Max) :
- ±20V
- Gate Charge (Qg) (Max) @ Vgs :
- 61nC @ 10V
- RoHS Status :
- Non-RoHS Compliant
- Current - Continuous Drain (Id) @ 25°C :
- 33A Tc
- Qualification Status :
- Not Qualified
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Mounting Type :
- Through Hole
- JESD-30 Code :
- R-PSFM-T3
- Configuration :
- SINGLE WITH BUILT-IN DIODE
- JESD-609 Code :
- e3
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Drain to Source Voltage (Vdss) :
- 55V
- ECCN Code :
- EAR99
- Terminal Finish :
- Matte Tin (Sn) - with Nickel (Ni) barrier
- Drain Current-Max (Abs) (ID) :
- 33A
- Pulsed Drain Current-Max (IDM) :
- 180A
- Transistor Application :
- SWITCHING
- Published :
- 1997
- Drain-source On Resistance-Max :
- 0.02Ohm
- Input Capacitance (Ciss) (Max) @ Vds :
- 1500pF @ 25V
- Rds On (Max) @ Id, Vgs :
- 20m Ω @ 19A, 10V
- FET Type :
- N-Channel
- Datasheets
- IRFIZ46N

N-Channel Tube 20m Ω @ 19A, 10V ±20V 1500pF @ 25V 61nC @ 10V 55V TO-220-3 Full Pack
IRFIZ46N Description
Fifth Generation HEXFETs from International Rectifier utilize advanced processing techniques to achieve the lowest possible on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET Power MOSFETs are well known for, provides the designer with an extremely efficient device for use in a wide variety of applications.
IRFIZ46N Features
Advanced Process Technology
Isolated Package
High Voltage Isolation = 2.5KVRMS ?
Sink to Lead Creepage Dist. = 4.8mm
Fully Avalanche Rated
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