IRFI530N
- Mfr.Part #
- IRFI530N
- Manufacturer
- Infineon Technologies
- Package / Case
- TO-220-3 Full Pack
- Datasheet
- Download
- Description
- MOSFET N-CH 100V 12A TO220AB FP
- Stock
- 40,012
- In Stock :
- 40,012
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Transistors - FETs, MOSFETs - Single
- Configuration :
- SINGLE WITH BUILT-IN DIODE
- Package / Case :
- TO-220-3 Full Pack
- Rds On (Max) @ Id, Vgs :
- 110m Ω @ 6.6A, 10V
- Operating Mode :
- ENHANCEMENT MODE
- ECCN Code :
- EAR99
- Mounting Type :
- Through Hole
- JEDEC-95 Code :
- TO-220AB
- Transistor Application :
- SWITCHING
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Additional Feature :
- AVALANCHE RATED
- DS Breakdown Voltage-Min :
- 100V
- Drain-source On Resistance-Max :
- 0.11Ohm
- Pulsed Drain Current-Max (IDM) :
- 60A
- Drain to Source Voltage (Vdss) :
- 100V
- Terminal Position :
- Single
- FET Type :
- N-Channel
- Avalanche Energy Rating (Eas) :
- 150 mJ
- Drain Current-Max (Abs) (ID) :
- 12A
- Vgs (Max) :
- ±20V
- RoHS Status :
- Non-RoHS Compliant
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Number of Terminations :
- 3
- Power Dissipation-Max :
- 41W Tc
- Published :
- 1998
- Vgs(th) (Max) @ Id :
- 4V @ 250µA
- Qualification Status :
- Not Qualified
- Case Connection :
- Isolated
- Gate Charge (Qg) (Max) @ Vgs :
- 44nC @ 10V
- Packaging :
- Tube
- JESD-30 Code :
- R-PSFM-T3
- Operating Temperature :
- -55°C~175°C TJ
- Series :
- HEXFET®
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Number of Elements :
- 1
- Current - Continuous Drain (Id) @ 25°C :
- 12A Tc
- Surface Mount :
- No
- Drive Voltage (Max Rds On,Min Rds On) :
- 10V
- Transistor Element Material :
- SILICON
- Input Capacitance (Ciss) (Max) @ Vds :
- 640pF @ 25V
- Datasheets
- IRFI530N

N-Channel Tube 110m Ω @ 6.6A, 10V ±20V 640pF @ 25V 44nC @ 10V 100V TO-220-3 Full Pack
IRFI530N Description
The IRFI530N is a HEXFET? fifth-generation N-channel Power MOSFET utilizing advanced processing techniques to achieve extremely low ON-resistance per silicon area. This benefit combined with the fast switching speed and ruggedized device design provides an extremely efficient and reliable operation. The package eliminates the need for additional insulating hardware. The molding compound used provides a high isolation capability and a low thermal resistance between the tab and external heat sink. This isolation is equivalent to using a 100-micron mica barrier. The package is mounted to a heat sink using a single clip or by a single screw fixing.
IRFI530N Features
-
Advanced process technology
-
Isolated package
-
Fully avalanche rating
-
Low static drain-to-source ON-resistance
-
Dynamic dV/dt rating
-
2.5kVRMS High voltage isolation
IRFI530N Applications
-
Commercial
-
Industrial
-
Power Management
-
Induction furnaces
-
Arc furnaces and arc welders
-
Steel rolling mills
-
Large motors with periodic loading
-
Thyristor drives
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