ESM24DTBN

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Mfr.Part #
ESM24DTBN
Manufacturer
Sullins Connector Solutions
Package / Case
Datasheet
Download
Description
CONN EDGE DUAL FMALE 48POS 0.156
Stock
34,814
In Stock :
34,814

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Manufacturer :
Sullins Connector Solutions
Product Category :
Edgeboard Connectors
Material - Insulation :
Polybutylene Terephthalate (PBT)
Packaging :
Tray
Connector Type :
Loop Bellows
JESD-609 Code :
e4
Dielectric Withstanding Voltage :
1800VDC V
Number Of PCB Rows :
2
RoHS Status :
ROHS3 Compliant
Mount :
Through Hole
Reference Standard :
UL, CSA
Total Number of Contacts :
48
Plating Thickness :
10μin
Operating Temperature :
-65°C~125°C
Number of Conductors :
ONE
Contact Material :
Phosphor Bronze
Number of Positions/Bay/Row :
24
Contact Finish :
Gold
Body Breadth :
0.37 inch
Gender :
FEMALE
Contact Finish Thickness :
10.0μin 0.25μm
Pitch :
0.156 3.96mm
Mounting Type :
Through Hole, Right Angle
PCB Contact Row Spacing :
3.81 mm
Color :
Blue
Body Depth :
0.76 inch
Termination :
Solder
Factory Lead Time :
3 Weeks
Published :
2015
Card Thickness :
0.062 1.57mm
PCB Contact Pattern :
RECTANGULAR
Body/Shell Style :
Receptacle
Moisture Sensitivity Level (MSL) :
Not Applicable
Reliability :
COMMERCIAL
Card Type :
Non Specified - Dual Edge
Additional Feature :
NONE
Insulation Resistance :
5000000000Ohm
Number of Positions :
48
Length - Termination :
0.18 inch
Pbfree Code :
yes
Contact Type :
Loop Bellows
Rated Current (Signal) :
3A
HTS Code :
8536.69.40.40
Contact Resistance :
10MOhm
Read Out :
Dual
Lead Free :
Lead Free
Number of Rows :
2
ECCN Code :
EAR99
Introducing Edgeboard Connectors Sullins Connector Solutions ESM24DTBN from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-65°C~125°C, Mounting Type:Through Hole, Right Angle, ESM24DTBN pinout, ESM24DTBN datasheet PDF, ESM24DTBN amp .Beyond Edgeboard Connectors Sullins Connector Solutions ESM24DTBN ,we also offer SM3ZS067U215AER1500, 1759547-1, 1-2199230-6, Our vast inventory has you covered. Contact us now for immediate solutions.



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