CYW15G0403DXB-BGI
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- Mfr.Part #
- CYW15G0403DXB-BGI
- Manufacturer
- Infineon Technologies
- Package / Case
- 256-LBGA Exposed Pad
- Datasheet
- Download
- Description
- IC TELECOM INTERFACE 256BGA
- Stock
- 4
- In Stock ：
- 4
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Telecom
- Width :
- 27mm
- Series :
- HOTlink II™
- Temperature Grade :
- Industrial
- Length :
- 27mm
- Peak Reflow Temperature (Cel) :
- 225
- Power Supplies :
- 3.3V
- Max Operating Temperature :
- 85°C
- Mount :
- Surface Mount
- Terminal Finish :
- Tin/Lead (Sn/Pb)
- Packaging :
- Tray
- Supply Voltage :
- 3.3V
- Telecom IC Type :
- TELECOM CIRCUIT
- Pin Count :
- 256
- Qualification Status :
- Not Qualified
- Min Operating Temperature :
- -40°C
- Number of Terminations :
- 256
- Package / Case :
- 256-LBGA Exposed Pad
- Terminal Pitch :
- 1.27mm
- Nominal Supply Current :
- 1.32A
- Mounting Type :
- Surface Mount
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Number of Functions :
- 1
- Base Part Number :
- CY*15G04
- RoHS Status :
- Non-RoHS Compliant
- Data Rate :
- 1500000 Mbps
- Number of Transceivers :
- 4
- JESD-609 Code :
- e0
- Reach Compliance Code :
- not_compliant
- Voltage - Supply :
- 3.135V~3.465V
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Number of Pins :
- 256
- Terminal Position :
- BOTTOM
- Number of Circuits :
- 4
- Terminal Form :
- Ball
- Datasheets
- CYW15G0403DXB-BGI
Telecom Infineon Technologies CYW15G0403DXB-BGI Overview
The Infineon Technologies CYW15G0403DXB-BGI is a high-performance IC telecom interface specifically designed to meet the rigorous demands of modern telecommunications infrastructure. This 256-ball grid array (BGA) integrated circuit offers exceptional reliability and functionality, making it an ideal choice for developers looking to enhance telecommunication systems. Its robust design ensures compatibility and easy integration with various telecommunications standards and protocols, facilitating rapid deployment and scalability in telecom networks.
CYW15G0403DXB-BGI Features
This IC telecom interface from Infineon Technologies features advanced signal processing capabilities, high-speed data transmission, and low power consumption. It supports a wide range of telecommunications applications, ensuring efficient and stable operation. The component's compact 256 BGA package allows for minimized board space usage, while providing the flexibility needed for sophisticated circuit designs.
CYW15G0403DXB-BGI Applications
- High-Speed Networks: Utilized in routers and switches, enhancing data throughput and reliability in high-speed telecommunications networks.
- Mobile Communication Infrastructure: Key component in base station transceivers, facilitating improved signal integrity and bandwidth management for mobile communications.
- VoIP Systems: Integral in Voice over IP (VoIP) gateways and equipment, ensuring clear and uninterrupted voice transmissions over internet protocol networks.
- Broadband Access: Used in broadband modems and access devices, enabling high-speed internet access and efficient data handling in residential and commercial environments.
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Shipping CostShipping Cost starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).If customer have shipping account, we can make shipment under customer’s shipping account with freight collect directly.
The basic freight (for package ≤0.5 KG ) depends on the time zones and countries
Once the goods are shipped, estimated delivery time depends on the shipping methods you chose. You can track it by the tracking no.
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