CYW15G0401DXB-BGXC
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- Mfr.Part #
- CYW15G0401DXB-BGXC
- Manufacturer
- Infineon Technologies
- Package / Case
- 256-LBGA Exposed Pad
- Datasheet
- Download
- Description
- IC TELECOM INTERFACE 256BGA
- Stock
- 37,320
- In Stock ：
- 37,320
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Telecom
- Voltage - Supply :
- 3.135V~3.465V
- Length :
- 27mm
- JESD-30 Code :
- S-PBGA-B256
- Surface Mount :
- yes
- Packaging :
- Tray
- Number of Terminations :
- 256
- Series :
- HOTlink II™
- RoHS Status :
- ROHS3 Compliant
- Qualification Status :
- COMMERCIAL
- Interface :
- LVTTL
- Telecom IC Type :
- TELECOM CIRCUIT
- Operating Temperature :
- 0°C~70°C
- Terminal Position :
- BOTTOM
- Width :
- 27mm
- Terminal Finish :
- TIN SILVER COPPER
- JESD-609 Code :
- e1
- Current - Supply :
- 830mA
- Terminal Pitch :
- 1.27mm
- Supply Voltage :
- 3.3V
- Function :
- Transceiver
- Peak Reflow Temperature (Cel) :
- 260
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Reach Compliance Code :
- Unknown
- Time@Peak Reflow Temperature-Max (s) :
- 20
- Terminal Form :
- Ball
- Number of Circuits :
- 4
- Mounting Type :
- Surface Mount
- Pbfree Code :
- yes
- Package / Case :
- 256-LBGA Exposed Pad
- Datasheets
- CYW15G0401DXB-BGXC
Telecom Infineon Technologies CYW15G0401DXB-BGXC Overview
The Telecom Infineon Technologies CYW15G0401DXB-BGXC IC is a highly sophisticated telecommunications interface component, designed to streamline and enhance communications technologies. Manufactured by Infineon Technologies, a leader in semiconductor and system solutions, this interface IC is encapsulated in a 256-pin BGA (Ball Grid Array) package, ensuring robust performance and reliability for high-density integration. Its architecture is specifically tailored for advanced telecom systems, providing efficient data transmission and signal integrity.
CYW15G0401DXB-BGXC Features
This IC offers an array of features suitable for high-performance telecom applications. It supports multiple telecom standards, ensuring versatility in deployment across various platforms. The high-speed interface capabilities facilitate enhanced data throughput and reduced latency, making it ideal for demanding telecommunications environments. Moreover, its compact 256BGA packaging allows for efficient space utilization in circuit designs, which is critical in modern electronic devices.
CYW15G0401DXB-BGXC Applications
- Telecommunication Switching Systems: Utilized in the core of telecommunication infrastructures to manage and route voice and data traffic efficiently.
- High-Speed Networks: Supports high data rate transfer and reliability for backbone network infrastructures and data centers.
- Wireless Base Stations: Essential for signal processing tasks within wireless communication systems, ensuring clear and uninterrupted service.
- Broadband Communication Equipment: Provides robust support for broadband systems, including cable and satellite internet services, enhancing connectivity and performance.
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Most of our products are shipped via FEDEX,DHL,UPS and SF EXPRESS...
Shipping CostShipping Cost starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).If customer have shipping account, we can make shipment under customer’s shipping account with freight collect directly.
The basic freight (for package ≤0.5 KG ) depends on the time zones and countries
Once the goods are shipped, estimated delivery time depends on the shipping methods you chose. You can track it by the tracking no.
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