CYW15G0401DXB-BGC

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Mfr.Part #
CYW15G0401DXB-BGC
Manufacturer
Infineon Technologies
Package / Case
256-LBGA Exposed Pad
Datasheet
Download
Description
IC TELECOM INTERFACE 256BGA
Stock
11,520
In Stock :
11,520

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Manufacturer :
Infineon Technologies
Product Category :
Telecom
RoHS Status :
Non-RoHS Compliant
Terminal Pitch :
1.27mm
Data Rate :
1500000 Mbps
Terminal Finish :
Tin/Lead (Sn/Pb)
Nominal Supply Current :
1.06A
Number of Transceivers :
4
Number of Pins :
256
Reach Compliance Code :
not_compliant
Interface :
LVTTL
Peak Reflow Temperature (Cel) :
225
Supply Voltage :
3.3V
Published :
2005
Operating Temperature :
0°C~70°C
Current - Supply :
830mA
Function :
Transceiver
Number of Circuits :
4
Package / Case :
256-LBGA Exposed Pad
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Width :
27mm
Length :
27mm
Voltage - Supply :
3.135V~3.465V
Base Part Number :
CY*15G04
Packaging :
Tray
Power Supplies :
3.3V
Series :
HOTlink II™
Mounting Type :
Surface Mount
Terminal Form :
Ball
JESD-609 Code :
e0
Qualification Status :
Not Qualified
Time@Peak Reflow Temperature-Max (s) :
30
Number of Terminations :
256
Mount :
Surface Mount
Terminal Position :
BOTTOM
Datasheets
CYW15G0401DXB-BGC
Introducing Telecom Infineon Technologies CYW15G0401DXB-BGC from Chip IC,where excellence meets affordability. This product stands out with its Number of Pins:256, Operating Temperature:0°C~70°C, Package / Case:256-LBGA Exposed Pad, Base Part Number:CY*15G04, Mounting Type:Surface Mount, Number of Terminations:256, CYW15G0401DXB-BGC pinout, CYW15G0401DXB-BGC datasheet PDF, CYW15G0401DXB-BGC amp .Beyond Telecom Infineon Technologies CYW15G0401DXB-BGC ,we also offer CPC5712UTR, MT8870DS1, SI32176-C-FM1R, Our vast inventory has you covered. Contact us now for immediate solutions.

Infineon Technologies CYW15G0401DXB-BGC


Telecom Infineon Technologies CYW15G0401DXB-BGC Overview

The Telecom Infineon Technologies CYW15G0401DXB-BGC is an advanced IC TELECOM INTERFACE, designed to meet the rigorous demands of high-speed communication infrastructures. Manufactured by Infineon Technologies, this integrated circuit is housed in a compact 256BGA package, offering robust performance and reliability for telecommunications systems. The CYW15G0401DXB-BGC integrates multiple functionalities necessary for modern telecom networks, including data processing, signal conditioning, and interface management, making it an indispensable part of large-scale deployments aimed at B2B clients looking to enhance system efficiency and communication reliability.

CYW15G0401DXB-BGC Features

This product boasts a range of features designed to enhance its performance in complex telecom environments. Key attributes include high data throughput capacity, low latency interface options, and advanced security protocols to ensure safe data transmission. Additionally, its compact 256BGA packaging allows for efficient use of board space, which is crucial in densely packed system configurations.

CYW15G0401DXB-BGC Applications

  • Telecommunications Networking: Enables robust data transmission and network management in telecom infrastructure.
  • High-Speed Servers: Supports server backbone architectures with high data integrity and speed.
  • Signal Conversion Systems: Applied in systems requiring high-frequency signal processing and conversion to maintain signal integrity across various platforms.
  • Broadband Communication Systems: Utilized in broadband hardware to enhance connectivity and throughput capabilities.
This HTML content effectively presents the Telecom Infineon Technologies CYW15G0401DXB-BGC IC TELECOM INTERFACE, highlighting its applications, features, and overall capabilities, tailored to attract B2B clients for bulk purchases.
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Shipping Cost

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