CYW15G0101DXB-BBXI

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Mfr.Part #
CYW15G0101DXB-BBXI
Manufacturer
Infineon Technologies
Package / Case
100-LBGA
Datasheet
Download
Description
IC TELECOM INTERFACE 100TBGA
Stock
14,020
In Stock :
14,020

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Manufacturer :
Infineon Technologies
Product Category :
Telecom
Function :
Transceiver
Nominal Supply Current :
510mA
Terminal Finish :
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form :
Ball
Reach Compliance Code :
Unknown
JESD-609 Code :
e1
Peak Reflow Temperature (Cel) :
260
Voltage - Supply :
3.135V~3.465V
Current - Supply :
390mA
RoHS Status :
ROHS3 Compliant
Power Supplies :
3.3V
Operating Temperature :
-40°C~85°C
Time@Peak Reflow Temperature-Max (s) :
20
Qualification Status :
Not Qualified
Package / Case :
100-LBGA
Number of Channels :
1
Supply Voltage :
3.3V
Mounting Type :
Surface Mount
Published :
2005
Base Part Number :
CY*15G01
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Mount :
Surface Mount
Number of Pins :
100
Number of Terminations :
100
Terminal Position :
BOTTOM
Packaging :
Tray
Series :
HOTlink II™
Number of Transceivers :
1
Interface :
LVTTL
Introducing Telecom Infineon Technologies CYW15G0101DXB-BBXI from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C~85°C, Package / Case:100-LBGA, Number of Channels:1, Mounting Type:Surface Mount, Base Part Number:CY*15G01, Number of Pins:100, Number of Terminations:100, CYW15G0101DXB-BBXI pinout, CYW15G0101DXB-BBXI datasheet PDF, CYW15G0101DXB-BBXI amp .Beyond Telecom Infineon Technologies CYW15G0101DXB-BBXI ,we also offer CPC5712UTR, MT8870DS1, SI32176-C-FM1R, Our vast inventory has you covered. Contact us now for immediate solutions.

Infineon Technologies CYW15G0101DXB-BBXI


Telecom Infineon Technologies CYW15G0101DXB-BBXI Overview

Designed for high-performance telecommunication systems, the Telecom Infineon Technologies CYW15G0101DXB-BBXI IC is a pivotal component in modern communication infrastructure. This IC from Infineon Technologies offers a robust interface solution housed in a 100TBGA package, ensuring reliable operation and integration into various telecommunications equipment. Its advanced technological features support enhanced data transmission capabilities, making it ideal for handling complex signals and high-speed operations. By employing this IC, manufacturers can expect not only superior performance but also a significant improvement in the efficiency and reliability of their telecommunication systems.

CYW15G0101DXB-BBXI Features

The CYW15G0101DXB-BBXI IC features a compact 100TBGA package that provides a high level of functionality while occupying minimal space on the device board. Its interface capabilities are optimized for telecommunication applications, facilitating seamless data flow and signal integrity. The IC's design focuses on reducing power consumption while maximizing performance, suitable for scalable telecommunication systems that require low operational costs with no compromise on throughput and reliability.

CYW15G0101DXB-BBXI Applications

  • Telecommunication Base Stations: Enhances signal processing capabilities for better network coverage and reliability.
  • Satellite Communications: Utilized in modulators and demodulators to ensure clear and continuous satellite signals.
  • Fiber Optic Transceivers: Plays a crucial role in managing data transmission over fiber optics, supporting higher bandwidths and data rates.
  • Wireless Communication Systems: Provides the necessary interface for high-speed wireless communication technologies, improving connectivity and data throughput.
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Shipping Cost

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