CYD09S72V18-200BGXI

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Mfr.Part #
CYD09S72V18-200BGXI
Manufacturer
Infineon Technologies
Package / Case
484-FBGA
Datasheet
Download
Description
IC SRAM 9MBIT PARALLEL 484FBGA
Stock
33,835
In Stock :
33,835

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Manufacturer :
Infineon Technologies
Product Category :
Memory
Packaging :
Tray
Supply Voltage-Max (Vsup) :
1.58V
Memory Size :
9Mb 128K x 72
Clock Frequency :
200MHz
Surface Mount :
yes
Terminal Finish :
NOT SPECIFIED
Supply Voltage :
1.5V
Mounting Type :
Surface Mount
Package / Case :
484-FBGA
Additional Feature :
PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATES AT 1.8V
Height Seated (Max) :
2.16mm
Time@Peak Reflow Temperature-Max (s) :
20
JESD-30 Code :
S-PBGA-B484
Reach Compliance Code :
Unknown
Terminal Position :
BOTTOM
Memory Width :
72
Peak Reflow Temperature (Cel) :
260
Width :
23mm
Number of Functions :
1
Access Time :
3.3ns
Operating Temperature :
-40°C~85°C TA
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Pin Count :
484
Organization :
128KX72
Memory Type :
Volatile
Terminal Pitch :
1mm
Supply Voltage-Min (Vsup) :
1.42V
Length :
23mm
Number of Terminations :
484
Qualification Status :
COMMERCIAL
Memory Interface :
Parallel
Pbfree Code :
yes
Memory Density :
9437184 bit
RoHS Status :
ROHS3 Compliant
Voltage - Supply :
1.42V~1.58V 1.7V~1.9V
Memory Format :
SRAM
Introducing Memory Infineon Technologies CYD09S72V18-200BGXI from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Package / Case:484-FBGA, Operating Temperature:-40°C~85°C TA, Number of Terminations:484, CYD09S72V18-200BGXI pinout, CYD09S72V18-200BGXI datasheet PDF, CYD09S72V18-200BGXI amp .Beyond Memory Infineon Technologies CYD09S72V18-200BGXI ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Infineon Technologies CYD09S72V18-200BGXI


Memory Infineon Technologies CYD09S72V18-200BGXI Overview

The Memory Infineon Technologies CYD09S72V18-200BGXI is a high-performance 9Mbit SRAM component packaged in a compact 484 FBGA form. Designed by Infineon Technologies, this integrated circuit ensures robust performance with its parallel interface, catering to applications demanding high-speed data access and reliability. This SRAM module is ideal for advanced computing systems requiring fast temporary data storage. The use of cutting-edge fabrication technology guarantees low power consumption and minimal latency, making it a key component for enhancing the overall performance of embedded systems, telecommunications infrastructure, and high-speed computing environments.

CYD09S72V18-200BGXI Features

This SRAM chip boasts several features that make it highly suitable for a range of advanced applications. It includes a parallel interface for rapid data access and manipulation, a large 9Mbit storage capacity for substantial data handling, and a reliable 484 FBGA package that ensures a compact footprint along with enhanced durability and thermal stability.

CYD09S72V18-200BGXI Applications

  • Embedded Systems: Utilized in microcontroller-based applications for fast and reliable temporary data storage, enhancing processing capabilities without compromising on system speed.
  • Telecommunication Equipment: Supports high-speed data operations in telecom infrastructure, improving data throughput and reliability in communication networks.
  • Automotive Electronics: Ideal for use in advanced driver-assistance systems (ADAS) where quick data retrieval is crucial for real-time decision-making.
  • Industrial Automation: Applied in control systems requiring rapid access to data to maintain high levels of precision and efficiency in automated processes.
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Shipping Method

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Shipping Cost

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