CYD09S72V18-200BGXI
- Mfr.Part #
- CYD09S72V18-200BGXI
- Manufacturer
- Infineon Technologies
- Package / Case
- 484-FBGA
- Datasheet
- Download
- Description
- IC SRAM 9MBIT PARALLEL 484FBGA
- Stock
- 33,835
- In Stock :
- 33,835
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Memory
- Packaging :
- Tray
- Supply Voltage-Max (Vsup) :
- 1.58V
- Memory Size :
- 9Mb 128K x 72
- Clock Frequency :
- 200MHz
- Surface Mount :
- yes
- Terminal Finish :
- NOT SPECIFIED
- Supply Voltage :
- 1.5V
- Mounting Type :
- Surface Mount
- Package / Case :
- 484-FBGA
- Additional Feature :
- PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATES AT 1.8V
- Height Seated (Max) :
- 2.16mm
- Time@Peak Reflow Temperature-Max (s) :
- 20
- JESD-30 Code :
- S-PBGA-B484
- Reach Compliance Code :
- Unknown
- Terminal Position :
- BOTTOM
- Memory Width :
- 72
- Peak Reflow Temperature (Cel) :
- 260
- Width :
- 23mm
- Number of Functions :
- 1
- Access Time :
- 3.3ns
- Operating Temperature :
- -40°C~85°C TA
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Pin Count :
- 484
- Organization :
- 128KX72
- Memory Type :
- Volatile
- Terminal Pitch :
- 1mm
- Supply Voltage-Min (Vsup) :
- 1.42V
- Length :
- 23mm
- Number of Terminations :
- 484
- Qualification Status :
- COMMERCIAL
- Memory Interface :
- Parallel
- Pbfree Code :
- yes
- Memory Density :
- 9437184 bit
- RoHS Status :
- ROHS3 Compliant
- Voltage - Supply :
- 1.42V~1.58V 1.7V~1.9V
- Memory Format :
- SRAM
- Datasheets
- CYD09S72V18-200BGXI

Memory Infineon Technologies CYD09S72V18-200BGXI Overview
The Memory Infineon Technologies CYD09S72V18-200BGXI is a high-performance 9Mbit SRAM component packaged in a compact 484 FBGA form. Designed by Infineon Technologies, this integrated circuit ensures robust performance with its parallel interface, catering to applications demanding high-speed data access and reliability. This SRAM module is ideal for advanced computing systems requiring fast temporary data storage. The use of cutting-edge fabrication technology guarantees low power consumption and minimal latency, making it a key component for enhancing the overall performance of embedded systems, telecommunications infrastructure, and high-speed computing environments.
CYD09S72V18-200BGXI Features
This SRAM chip boasts several features that make it highly suitable for a range of advanced applications. It includes a parallel interface for rapid data access and manipulation, a large 9Mbit storage capacity for substantial data handling, and a reliable 484 FBGA package that ensures a compact footprint along with enhanced durability and thermal stability.
CYD09S72V18-200BGXI Applications
- Embedded Systems: Utilized in microcontroller-based applications for fast and reliable temporary data storage, enhancing processing capabilities without compromising on system speed.
- Telecommunication Equipment: Supports high-speed data operations in telecom infrastructure, improving data throughput and reliability in communication networks.
- Automotive Electronics: Ideal for use in advanced driver-assistance systems (ADAS) where quick data retrieval is crucial for real-time decision-making.
- Industrial Automation: Applied in control systems requiring rapid access to data to maintain high levels of precision and efficiency in automated processes.
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