CYD02S36V18-200BBXC

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Mfr.Part #
CYD02S36V18-200BBXC
Manufacturer
Infineon Technologies
Package / Case
256-LBGA
Datasheet
Download
Description
IC SRAM 2MBIT PARALLEL 256FBGA
Stock
2,426
In Stock :
2,426

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Manufacturer :
Infineon Technologies
Product Category :
Memory
Packaging :
Tray
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Operating Temperature :
0°C~70°C TA
Mounting Type :
Surface Mount
Package / Case :
256-LBGA
Memory Format :
SRAM
Access Time :
3.3ns
RoHS Status :
ROHS3 Compliant
Memory Size :
2Mb 64K x 36
Supplier Device Package :
256-FBGA (17x17)
Memory Type :
Volatile
Memory Interface :
Parallel
Clock Frequency :
200MHz
Voltage - Supply :
1.7V~1.9V
Introducing Memory Infineon Technologies CYD02S36V18-200BBXC from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C~70°C TA, Mounting Type:Surface Mount, Package / Case:256-LBGA, CYD02S36V18-200BBXC pinout, CYD02S36V18-200BBXC datasheet PDF, CYD02S36V18-200BBXC amp .Beyond Memory Infineon Technologies CYD02S36V18-200BBXC ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Infineon Technologies CYD02S36V18-200BBXC


Memory Infineon Technologies CYD02S36V18-200BBXC Overview

The Memory Infineon Technologies CYD02S36V18-200BBXC is a cutting-edge Integrated Circuit (IC) that offers robust performance for applications requiring high-speed and reliable data storage. This 2Mbit SRAM device, housed in a 256FBGA package, is designed by Infineon Technologies, a leader in semiconductor innovation. With its parallel interface, it provides high-speed data access, making it an ideal solution for demanding electronic systems where quick memory access and integrity are crucial. Its compact form factor and energy efficiency also ensure it can be integrated into modern electronic assemblies without compromising on performance.

CYD02S36V18-200BBXC Features

The CYD02S36V18-200BBXC boasts several features that make it stand out. These include its high-density 2MB storage capacity and a parallel interface that ensures fast data transfer rates, which is vital for high-performance computing environments. The device's 256FBGA packaging is not only space-efficient but also offers better thermal management and reliability under stress. Furthermore, its low power consumption makes it suitable for portable and power-sensitive applications.

CYD02S36V18-200BBXC Applications

  • Automotive Systems: Utilized in engine control units and infotainment systems where quick access to data is crucial for performance and functionality.
  • Industrial Automation: Employs in PLCs and other control systems that require fast and reliable data storage to ensure seamless factory operations.
  • Telecommunications: Integrated into networking equipment such as routers and switches, enhancing performance through rapid access to routing tables and buffer memory.
  • Consumer Electronics: Used in high-performance gaming consoles and smart home devices, where speed and reliability enhance the user experience.
  • Medical Devices: Critical in medical monitoring systems where precision and speed of data access can impact diagnostic capabilities.
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Shipping Method

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Shipping Cost

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