CYD09S72V18-200BBXC

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Mfr.Part #
CYD09S72V18-200BBXC
Manufacturer
Infineon Technologies
Package / Case
256-LBGA
Datasheet
Download
Description
IC SRAM 9MBIT PARALLEL 256FBGA
Stock
44,198
In Stock :
44,198

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Manufacturer :
Infineon Technologies
Product Category :
Memory
Memory Width :
72
Published :
2005
Sync/Async :
SYNCHRONOUS
JESD-30 Code :
S-PBGA-B484
Memory Size :
9Mb 128K x 72
Word Size :
72b
Qualification Status :
Not Qualified
Access Time :
3.3ns
Memory Format :
SRAM
Package / Case :
256-LBGA
Memory Interface :
Parallel
Pin Count :
484
Number of Terminations :
484
Operating Supply Voltage :
1.8V
Memory Type :
Volatile
Terminal Pitch :
1mm
Mount :
Surface Mount
Terminal Position :
BOTTOM
Packaging :
Tray
Operating Temperature :
0°C~70°C TA
Number of Pins :
256
Supply Voltage-Max (Vsup) :
1.58V
Address Bus Width :
34b
Lead Free :
Lead Free
Supply Voltage :
1.5V
Number of Functions :
1
Voltage - Supply :
1.42V~1.58V 1.7V~1.9V
Mounting Type :
Surface Mount
Density :
9 Mb
RoHS Status :
ROHS3 Compliant
Clock Frequency :
200MHz
Moisture Sensitivity Level (MSL) :
5 (48 Hours)
Number of Ports :
2
Base Part Number :
CYD09S72
Introducing Memory Infineon Technologies CYD09S72V18-200BBXC from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:256-LBGA, Number of Terminations:484, Operating Temperature:0°C~70°C TA, Number of Pins:256, Mounting Type:Surface Mount, Base Part Number:CYD09S72, CYD09S72V18-200BBXC pinout, CYD09S72V18-200BBXC datasheet PDF, CYD09S72V18-200BBXC amp .Beyond Memory Infineon Technologies CYD09S72V18-200BBXC ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Infineon Technologies CYD09S72V18-200BBXC


Memory Infineon Technologies CYD09S72V18-200BBXC Overview

Designed for high-performance applications that require large, fast, and reliable data storage, the Memory Infineon Technologies CYD09S72V18-200BBXC integrates cutting-edge technology into your systems. This 9Mbit SRAM device from Infineon Technologies offers a robust storage solution with a parallel interface, encapsulated in a compact 256FBGA package. Its design focuses on achieving low-latency and high-throughput data access, making it an ideal choice for demanding electronic environments where quick data retrieval and integrity are paramount. The use of advanced fabrication techniques ensures that this memory module delivers durability and consistent performance, supporting the rigorous needs of both industrial and commercial applications.

CYD09S72V18-200BBXC Features

The CYD09S72V18-200BBXC SRAM features a dense 9Mbit configuration which allows for efficient space utilization and system miniaturization. Its parallel interface ensures high-speed data transfers, suitable for applications requiring rapid access to large volumes of data. The 256FBGA package not only minimizes the physical footprint but also enhances thermal stability and improves signal integrity. This SRAM is designed to support a wide range of operating temperatures, making it versatile for use in varying environmental conditions.

CYD09S72V18-200BBXC Applications

  • Advanced Industrial Controls: Utilizes its fast access time and large memory capacity to handle complex algorithms and control tasks in real-time.
  • Telecommunications Infrastructure: Supports high-speed data processing needs for routers and switches, ensuring efficiency in data packet management and communication reliability.
  • Automotive Applications: Reliable performance under a range of environmental conditions makes it suitable for use in automotive electronics, including navigation and infotainment systems.
  • Medical Equipment: Its quick data retrieval capabilities enable high-performance in medical imaging and diagnostic systems, where speed and accuracy are crucial.
  • Consumer Electronics: Ideal for applications in high-end gaming consoles and smart home devices, providing the necessary speed and capacity for enhanced user experiences.
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Shipping Cost

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