CYD09S72V18-167BGXC

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Mfr.Part #
CYD09S72V18-167BGXC
Manufacturer
Infineon Technologies
Package / Case
484-BGA
Datasheet
Download
Description
DUAL-PORT SRAM, 128KX72, 11NS PB
Stock
32
In Stock :
32

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Manufacturer :
Infineon Technologies
Product Category :
Memory
Seated Height-Max :
2.16 mm
Temperature Grade :
COMMERCIAL
Manufacturer :
Cypress Semiconductor
JESD-609 Code :
e1
Terminal Pitch :
1 mm
Memory Width :
72
Base Product Number :
CYD09S72
Standby Current-Max :
0.2 A
Package / Case :
484-BGA
Package :
Bulk
Number of Functions :
1
Reach Compliance Code :
Compliant
Length :
23 mm
ECCN Code :
3A991.B.2.A
Width :
23 mm
Number of Words :
131072 words
Operating Mode :
SYNCHRONOUS
Clock Frequency :
167 MHz
Qualification Status :
Not Qualified
JESD-30 Code :
S-PBGA-B484
Organization :
128KX72
Memory IC Type :
DUAL-PORT SRAM
Standby Voltage-Min :
1.4 V
Memory Format :
SRAM
Technology :
SRAM - Dual Port, Standard
Memory Type :
Volatile
Memory Density :
9437184 bit
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Terminal Form :
Ball
Supply Voltage-Max (Vsup) :
1.58 V
Additional Feature :
PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATES AT 1.8V
Write Cycle Time - Word, Page :
-
Subcategory :
SRAMs
Series :
-
Supply Current-Max :
0.7 mA
Power Supplies :
1.5/1.8 V
Voltage - Supply :
1.7V ~ 1.9V, 2.4V ~ 2.6V, 2.7V ~ 3.3V
Terminal Position :
BOTTOM
Pbfree Code :
yes
Package Shape :
Square
Memory Size :
9Mbit
Memory Interface :
Parallel
Supplier Device Package :
484-PBGA (23x23)
RoHS :
Non-Compliant
Mounting Type :
Surface Mount
Supply Voltage-Min (Vsup) :
1.42 V
Number of Ports :
2
Operating Temperature :
0°C ~ 70°C (TA)
Parallel/Serial :
Parallel
Product Status :
Active
Memory Organization :
128K x 72
Access Time :
3.3 ns
Terminal Finish :
Tin/Silver/Copper (Sn/Ag/Cu)
Number of Terminals :
484
HTS Code :
8542.32.00.41
I/O Type :
COMMON
Surface Mount :
yes
Pin Count :
484
Output Characteristics :
3-STATE
Introducing Memory Infineon Technologies CYD09S72V18-167BGXC from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:484-BGA, Mounting Type:Surface Mount, Operating Temperature:0°C ~ 70°C (TA), CYD09S72V18-167BGXC pinout, CYD09S72V18-167BGXC datasheet PDF, CYD09S72V18-167BGXC amp .Beyond Memory Infineon Technologies CYD09S72V18-167BGXC ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Infineon Technologies CYD09S72V18-167BGXC


[Memory Infineon Technologies CYD09S72V18-167BGXC] Overview

Introducing the cutting-edge DUALPORT SRAM, 128KX72, 11NS PB from Infineon Technologies, the pioneer in advanced semiconductor solutions. Designed to meet the demanding requirements of high-performance computing systems, this state-of-the-art memory module delivers unparalleled speed, reliability, and versatility.

With its dual-port architecture and expansive 128KX72 configuration, this SRAM module redefines memory capabilities, offering lightning-fast data access and transfer rates. Whether powering critical enterprise applications or driving innovative computing solutions, this Infineon memory solution sets the benchmark for efficiency and performance.

[CYD09S72V18-167BGXC] Features

  • High-speed dual-port SRAM
  • 128KX72 configuration
  • Ultra-fast 11NS PB access time
  • Robust and reliable performance
  • Low power consumption
  • Industrial-grade quality
  • Extended temperature range
  • Easy integration with existing systems
  • Designed for mission-critical applications

[CYD09S72V18-167BGXC] Applications

  • Networking Equipment: Empower routers, switches, and network appliances with high-speed data buffering and packet processing capabilities, ensuring seamless data flow and low latency in demanding networking environments.
  • Telecommunications Systems: Enhance the performance and reliability of telecommunications infrastructure, enabling fast data access and processing for voice, video, and data transmission applications, even in harsh operating conditions.
  • Industrial Automation: Drive efficiency and precision in industrial automation systems, facilitating real-time control and monitoring tasks with rapid data exchange and processing, critical for optimizing production processes and ensuring operational excellence.
  • Medical Devices: Enable advanced medical diagnostic equipment with rapid data retrieval and processing capabilities, supporting real-time analysis and decision-making in critical healthcare applications, such as medical imaging and patient monitoring systems.
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