CYD09S72V18-167BBXC

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Mfr.Part #
CYD09S72V18-167BBXC
Manufacturer
Infineon Technologies
Package / Case
256-LBGA
Datasheet
Download
Description
IC SRAM 9MBIT PARALLEL 256FBGA
Stock
19,066
In Stock :
19,066

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Manufacturer :
Infineon Technologies
Product Category :
Memory
Pin Count :
484
Qualification Status :
COMMERCIAL
Additional Feature :
PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATES AT 1.8V
Organization :
128KX72
Operating Temperature :
0°C~70°C TA
Supply Voltage-Min (Vsup) :
1.42V
Terminal Position :
BOTTOM
Terminal Pitch :
1mm
Supply Voltage :
1.5V
Reach Compliance Code :
Unknown
Package / Case :
256-LBGA
Memory Density :
9437184 bit
Width :
23mm
Mounting Type :
Surface Mount
Surface Mount :
yes
Height Seated (Max) :
2.16mm
Supply Voltage-Max (Vsup) :
1.58V
Memory Interface :
Parallel
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Length :
23mm
Memory Width :
72
Memory Size :
9Mb 128K x 72
Clock Frequency :
167MHz
Number of Functions :
1
Packaging :
Tray
RoHS Status :
ROHS3 Compliant
Memory Type :
Volatile
Voltage - Supply :
1.42V~1.58V 1.7V~1.9V
Number of Terminations :
484
JESD-30 Code :
S-PBGA-B484
Memory Format :
SRAM
Access Time :
4ns
Introducing Memory Infineon Technologies CYD09S72V18-167BBXC from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C~70°C TA, Package / Case:256-LBGA, Mounting Type:Surface Mount, Number of Terminations:484, CYD09S72V18-167BBXC pinout, CYD09S72V18-167BBXC datasheet PDF, CYD09S72V18-167BBXC amp .Beyond Memory Infineon Technologies CYD09S72V18-167BBXC ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Infineon Technologies CYD09S72V18-167BBXC


Memory Infineon Technologies CYD09S72V18-167BBXC Overview

Introducing the Memory Infineon Technologies CYD09S72V18-167BBXC, a high-performance 9Mbit SRAM chip from Infineon Technologies, designed to deliver outstanding speed and reliability for sophisticated electronic applications. This IC employs a parallel interface and is encapsulated in a compact 256FBGA package, ensuring efficient space utilization and simplified integration into existing systems. Its robust architecture provides enhanced data integrity and speed, making it ideal for demanding operational environments where quick access to large volumes of data is crucial.

CYD09S72V18-167BBXC Features

This SRAM unit offers a range of features suited for high-speed data applications, including a fast access time that significantly enhances system performance. The parallel interface ensures broad compatibility with existing and emerging technologies, facilitating easy integration into product designs. Moreover, the 256FBGA packaging not only provides a robust physical protection but also aids in efficient heat dissipation, critical for maintaining system stability and prolonging life span.

CYD09S72V18-167BBXC Applications

  • Advanced Computing Systems: Utilized in server and high-performance computing scenarios where rapid data retrieval and high data throughput are necessary.
  • Networking Equipment: Applied in routers, switches, and other network infrastructure to enhance buffer memory capabilities and improve data flow management.
  • Industrial Automation: Helps to manage process control data effectively in real-time, improving responsiveness and operational efficiency in automated production lines.
  • Aerospace and Defense: Integral in systems requiring high reliability and fast access to data for mission-critical applications in challenging environments.
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Shipping Cost

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