CYD09S72V18-167BBXC
- Mfr.Part #
- CYD09S72V18-167BBXC
- Manufacturer
- Infineon Technologies
- Package / Case
- 256-LBGA
- Datasheet
- Download
- Description
- IC SRAM 9MBIT PARALLEL 256FBGA
- Stock
- 19,066
- In Stock :
- 19,066
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Memory
- Pin Count :
- 484
- Qualification Status :
- COMMERCIAL
- Additional Feature :
- PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATES AT 1.8V
- Organization :
- 128KX72
- Operating Temperature :
- 0°C~70°C TA
- Supply Voltage-Min (Vsup) :
- 1.42V
- Terminal Position :
- BOTTOM
- Terminal Pitch :
- 1mm
- Supply Voltage :
- 1.5V
- Reach Compliance Code :
- Unknown
- Package / Case :
- 256-LBGA
- Memory Density :
- 9437184 bit
- Width :
- 23mm
- Mounting Type :
- Surface Mount
- Surface Mount :
- yes
- Height Seated (Max) :
- 2.16mm
- Supply Voltage-Max (Vsup) :
- 1.58V
- Memory Interface :
- Parallel
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Length :
- 23mm
- Memory Width :
- 72
- Memory Size :
- 9Mb 128K x 72
- Clock Frequency :
- 167MHz
- Number of Functions :
- 1
- Packaging :
- Tray
- RoHS Status :
- ROHS3 Compliant
- Memory Type :
- Volatile
- Voltage - Supply :
- 1.42V~1.58V 1.7V~1.9V
- Number of Terminations :
- 484
- JESD-30 Code :
- S-PBGA-B484
- Memory Format :
- SRAM
- Access Time :
- 4ns
- Datasheets
- CYD09S72V18-167BBXC

Memory Infineon Technologies CYD09S72V18-167BBXC Overview
Introducing the Memory Infineon Technologies CYD09S72V18-167BBXC, a high-performance 9Mbit SRAM chip from Infineon Technologies, designed to deliver outstanding speed and reliability for sophisticated electronic applications. This IC employs a parallel interface and is encapsulated in a compact 256FBGA package, ensuring efficient space utilization and simplified integration into existing systems. Its robust architecture provides enhanced data integrity and speed, making it ideal for demanding operational environments where quick access to large volumes of data is crucial.
CYD09S72V18-167BBXC Features
This SRAM unit offers a range of features suited for high-speed data applications, including a fast access time that significantly enhances system performance. The parallel interface ensures broad compatibility with existing and emerging technologies, facilitating easy integration into product designs. Moreover, the 256FBGA packaging not only provides a robust physical protection but also aids in efficient heat dissipation, critical for maintaining system stability and prolonging life span.
CYD09S72V18-167BBXC Applications
- Advanced Computing Systems: Utilized in server and high-performance computing scenarios where rapid data retrieval and high data throughput are necessary.
- Networking Equipment: Applied in routers, switches, and other network infrastructure to enhance buffer memory capabilities and improve data flow management.
- Industrial Automation: Helps to manage process control data effectively in real-time, improving responsiveness and operational efficiency in automated production lines.
- Aerospace and Defense: Integral in systems requiring high reliability and fast access to data for mission-critical applications in challenging environments.
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Most of our products are shipped via FEDEX,DHL,UPS and SF EXPRESS...
Shipping CostShipping Cost starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).If customer have shipping account, we can make shipment under customer’s shipping account with freight collect directly.
The basic freight (for package ≤0.5 KG ) depends on the time zones and countries
Once the goods are shipped, estimated delivery time depends on the shipping methods you chose. You can track it by the tracking no.
















