CYD09S36V18-200BBXC

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Mfr.Part #
CYD09S36V18-200BBXC
Manufacturer
Infineon Technologies
Package / Case
256-LBGA
Datasheet
Download
Description
IC SRAM 9MBIT PARALLEL 256FBGA
Stock
14,731
In Stock :
14,731

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Manufacturer :
Infineon Technologies
Product Category :
Memory
Lead Free :
Lead Free
I/O Type :
COMMON
Address Bus Width :
18b
Memory Format :
SRAM
Terminal Pitch :
1mm
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Memory Interface :
Parallel
Terminal Position :
BOTTOM
Reach Compliance Code :
Unknown
Density :
9 Mb
Memory Width :
36
Voltage - Supply :
1.42V~1.58V 1.7V~1.9V
JESD-609 Code :
e1
Memory Size :
9Mb 256K x 36
Mounting Type :
Surface Mount
Access Time :
3.3ns
Additional Feature :
PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATES AT 1.8V
Memory Type :
Volatile
Pin Count :
256
Package / Case :
256-LBGA
Number of Functions :
1
Qualification Status :
Not Qualified
Time@Peak Reflow Temperature-Max (s) :
20
Length :
17mm
Pbfree Code :
yes
Operating Supply Voltage :
1.8V
Number of Pins :
256
Base Part Number :
CYD09S36
Packaging :
Tray
Terminal Finish :
Tin/Silver/Copper (Sn/Ag/Cu)
Supply Voltage :
1.5V
RoHS Status :
ROHS3 Compliant
Number of Ports :
2
Standby Voltage-Min :
1.4V
Operating Temperature :
0°C~70°C TA
Height Seated (Max) :
1.7mm
Published :
2006
Supply Current-Max :
0.64mA
Number of Terminations :
256
Output Characteristics :
3-STATE
Supply Voltage-Max (Vsup) :
1.58V
Clock Frequency :
200MHz
Surface Mount :
yes
Peak Reflow Temperature (Cel) :
260
Introducing Memory Infineon Technologies CYD09S36V18-200BBXC from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Package / Case:256-LBGA, Number of Pins:256, Base Part Number:CYD09S36, Operating Temperature:0°C~70°C TA, Number of Terminations:256, CYD09S36V18-200BBXC pinout, CYD09S36V18-200BBXC datasheet PDF, CYD09S36V18-200BBXC amp .Beyond Memory Infineon Technologies CYD09S36V18-200BBXC ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Infineon Technologies CYD09S36V18-200BBXC


Memory Infineon Technologies CYD09S36V18-200BBXC Overview

The Memory Infineon Technologies CYD09S36V18-200BBXC is a high-performance 9Mbit SRAM IC, designed by Infineon Technologies to meet the demanding needs of advanced digital systems. Featuring a 256-FBGA package, this memory component excels in environments requiring high-speed, reliable data storage and retrieval without the latency often associated with other memory types. Its parallel interface ensures fast data access times, making it an ideal choice for applications where speed and performance are critical. With its robust design and cutting-edge technology, the Memory Infineon Technologies CYD09S36V18-200BBXC provides a reliable solution for developers looking to push the boundaries of what's possible with electronic systems.

CYD09S36V18-200BBXC Features

  • 9Mbit storage capacity, ensuring ample space for high-speed data operations.
  • Parallel interface for rapid data access and throughput.
  • Encased in a compact 256-FBGA package, ideal for space-constrained applications.
  • Engineered for high reliability and durability under varying operational conditions.

CYD09S36V18-200BBXC Applications

  • Networking Equipment: Utilized in routers and switches to enhance buffering and caching capabilities.
  • Telecommunications: Critical for data retention in telecommunications infrastructure, supporting fast access to routing and subscriber information.
  • Industrial Automation: Helps in managing real-time data processing and storage in automation control systems.
  • Medical Devices: Ensures quick, reliable access to data in medical imaging systems, improving diagnostic accuracy and patient care.
  • Aerospace: Integral in flight systems for storing mission-critical data that requires quick retrieval in challenging environments.
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