CYD09S36V18-200BBXC

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Mfr.Part #
CYD09S36V18-200BBXC
Manufacturer
Infineon Technologies
Package / Case
256-LBGA
Datasheet
Download
Description
IC SRAM 9MBIT PARALLEL 256FBGA
Stock
14,731
In Stock :
14,731

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Manufacturer :
Infineon Technologies
Product Category :
Memory
Qualification Status :
Not Qualified
Height Seated (Max) :
1.7mm
Lead Free :
Lead Free
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Terminal Finish :
Tin/Silver/Copper (Sn/Ag/Cu)
Address Bus Width :
18b
Packaging :
Tray
Package / Case :
256-LBGA
JESD-609 Code :
e1
Memory Format :
SRAM
Number of Terminations :
256
Pbfree Code :
yes
Time@Peak Reflow Temperature-Max (s) :
20
I/O Type :
COMMON
Access Time :
3.3ns
Standby Voltage-Min :
1.4V
Published :
2006
Operating Supply Voltage :
1.8V
Terminal Pitch :
1mm
Number of Ports :
2
Reach Compliance Code :
Unknown
Length :
17mm
Surface Mount :
yes
Operating Temperature :
0°C~70°C TA
Pin Count :
256
Supply Current-Max :
0.64mA
Number of Functions :
1
Supply Voltage-Max (Vsup) :
1.58V
Supply Voltage :
1.5V
Peak Reflow Temperature (Cel) :
260
Output Characteristics :
3-STATE
Memory Size :
9Mb 256K x 36
Memory Type :
Volatile
Density :
9 Mb
Voltage - Supply :
1.42V~1.58V 1.7V~1.9V
Base Part Number :
CYD09S36
Terminal Position :
BOTTOM
Mounting Type :
Surface Mount
Memory Width :
36
RoHS Status :
ROHS3 Compliant
Clock Frequency :
200MHz
Number of Pins :
256
Additional Feature :
PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATES AT 1.8V
Memory Interface :
Parallel
Introducing Memory Infineon Technologies CYD09S36V18-200BBXC from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:256-LBGA, Number of Terminations:256, Operating Temperature:0°C~70°C TA, Base Part Number:CYD09S36, Mounting Type:Surface Mount, Number of Pins:256, CYD09S36V18-200BBXC pinout, CYD09S36V18-200BBXC datasheet PDF, CYD09S36V18-200BBXC amp .Beyond Memory Infineon Technologies CYD09S36V18-200BBXC ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Infineon Technologies CYD09S36V18-200BBXC


Memory Infineon Technologies CYD09S36V18-200BBXC Overview

The Memory Infineon Technologies CYD09S36V18-200BBXC is a high-performance 9Mbit SRAM IC, designed by Infineon Technologies to meet the demanding needs of advanced digital systems. Featuring a 256-FBGA package, this memory component excels in environments requiring high-speed, reliable data storage and retrieval without the latency often associated with other memory types. Its parallel interface ensures fast data access times, making it an ideal choice for applications where speed and performance are critical. With its robust design and cutting-edge technology, the Memory Infineon Technologies CYD09S36V18-200BBXC provides a reliable solution for developers looking to push the boundaries of what's possible with electronic systems.

CYD09S36V18-200BBXC Features

  • 9Mbit storage capacity, ensuring ample space for high-speed data operations.
  • Parallel interface for rapid data access and throughput.
  • Encased in a compact 256-FBGA package, ideal for space-constrained applications.
  • Engineered for high reliability and durability under varying operational conditions.

CYD09S36V18-200BBXC Applications

  • Networking Equipment: Utilized in routers and switches to enhance buffering and caching capabilities.
  • Telecommunications: Critical for data retention in telecommunications infrastructure, supporting fast access to routing and subscriber information.
  • Industrial Automation: Helps in managing real-time data processing and storage in automation control systems.
  • Medical Devices: Ensures quick, reliable access to data in medical imaging systems, improving diagnostic accuracy and patient care.
  • Aerospace: Integral in flight systems for storing mission-critical data that requires quick retrieval in challenging environments.
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